Hybrid Thermally Conductive Insulating Adhesive for Bonding Strength
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Solution Overview
Problem
Existing thermally conductive adhesives struggle to achieve high thermal conductivity and strong bonding performance simultaneously due to limitations in thermal conductivity and bonding strength, particularly in organic and inorganic adhesives.
Innovation Solution
A method for preparing an organic/inorganic hybrid high thermally conductive and insulating two-component adhesive, involving the preparation of an organic phase aluminum dihydrogen phosphate, treatment of diamond fillers, and modification of polyurethane to form a dual-network thermally conductive adhesive with a three-dimensional network.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive filler is added to organic resin to improve thermal conductivity, then thermal conductivity is improved, but bonding performance deteriorates and viscosity increases significantly
Solution Approach 1:
The patent creates an organic/inorganic hybrid adhesive system combining aluminum dihydrogen phosphate (inorganic) with polyurethane and thermally conductive fillers (organic). This composite structure achieves thermal conductivity greater than 2.5 W/m·k while maintaining bonding performance greater than 10 MPa, resolving the contradiction between thermal conductivity and bonding strength that plagues traditional single-phase adhesives.
Solution Approach 2:
The patent optimizes the mass ratio of aluminum dihydrogen phosphate to polyurethane adhesive at 1:1 to 1:3, and controls the content of thermally conductive filler between 30-70 parts per 100 parts of adhesive. These parameter optimizations enable the adhesive to simultaneously achieve high thermal conductivity and strong bonding performance, overcoming the trade-off limitation.
2Temperature
If inorganic adhesive materials are used to achieve high intrinsic thermal conductivity, then thermal conductivity is improved, but brittleness increases and adhesive strength decreases
Solution Approach 1:
The patent combines inorganic aluminum dihydrogen phosphate with organic polyurethane adhesive to create a hybrid material that leverages the high thermal conductivity of inorganic materials while the organic component provides flexibility and adhesion. The resulting composite achieves thermal conductivity greater than 2.5 W/m·k while maintaining bonding performance greater than 10 MPa, eliminating the brittleness and low strength issues of pure inorganic adhesives.
Solution Approach 2:
The patent creates a dual-network structure where aluminum dihydrogen phosphate forms an inorganic network for thermal conduction, while polyurethane forms an organic network for adhesion and flexibility. This local differentiation of material functions within the composite enables simultaneous achievement of high thermal conductivity and strong bonding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid adhesive achieves high thermal conductivity, excellent insulation, and strong bonding performance, addressing the limitations of traditional adhesives by enhancing thermal conductivity and bonding strength while maintaining low thermal expansion.
Implementation Method 1
aluminum dihydrogen phosphate... having an intrinsic thermal conductivity up to 5 W/(m·k), which is much higher than that of organic polymers
Implementation Method 2
adding a thermally conductive filler to the resin... diamond particles
Implementation Method 3
Thermally conductive adhesive is a resin used to bond and conduct heat between components
Data Source
AI summary
Provided are a method for preparing an organic/inorganic hybrid thermally conductive and insulating two-component adhesive and a method for using the same. The purpose is to solve the problem that thermally conductive adhesives in the prior art cannot meet the requirements of thermal conductivity, good bonding performance and insulation characteristics at the same time. The method includes: 1. preparing an organic phase aluminum dihydrogen phosphate; 2. treating a diamond thermally conductive filler; 3. modifying polyurethane compatible with aluminum dihydrogen phosphate; and 4. preparing an organic/inorganic hybrid insulating two-component adhesive. The use method includes: coating the adhesive onto a surface of a material to be bonded, and bonding; and subjecting a resulting member to be bonded to defoaming, heating, and holding.