Hybrid Contact Socket for Fine Pitch Semiconductor Testing
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Solution Overview
Problem
Conventional test sockets, particularly pin-type and rubber-type, face issues such as signal loss in high-frequency bands, complex manufacturing processes, reduced durability due to elasticity loss, and increased costs, especially in fine pitch devices where insulation distances are critical and thermal stress affects electrical contacts.
Innovation Solution
A hybrid-type contact and test socket device featuring a first contact unit with a cylindrical shape formed by rolling a metal strip pattern, a second contact unit with conductivity and elasticity, and an insulating elastic molding portion to integrate these units, optimizing mechanical and electrical properties for extended service life and reliability in high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pin-type test socket is used to achieve electrical connection, then electrical connection is established, but signal loss occurs due to long current path in spiral or curved structure
Solution Approach 1:
The contact structure is divided into multiple linear contact segments instead of a single curved path. Each segment maintains direct electrical contact, reducing the overall current path length and signal loss while preserving connection stability.
Solution Approach 2:
The contact arrangement transitions from a two-dimensional curved/spiral path to a three-dimensional linear configuration, optimizing the current path by utilizing vertical and horizontal dimensions efficiently to minimize signal loss.
2Stability of the object's composition
If pin-type test socket with spiral structure is used, then elasticity is achieved, but manufacturing process becomes complicated and cost increases
Solution Approach 1:
The elastic structure is segmented into multiple linear contact elements with individual elasticity mechanisms, replacing the complex integrated spiral structure. This simplifies manufacturing while maintaining overall elastic functionality through the collective behavior of segments.
Solution Approach 2:
Elasticity is localized to specific regions of each contact element rather than requiring the entire structure to be spiral-shaped. This allows linear contacts to achieve elasticity through localized spring elements or flexible sections, reducing overall structural complexity.
3Stability of the object's composition
If rubber-type test socket is used, then elasticity and insulation are achieved, but service life is reduced due to elasticity loss during repetitive testing
Solution Approach 1:
The contact structure combines metal linear contacts with insulating materials in a composite configuration. The metal components provide durable elastic recovery through controlled deformation, while insulating materials maintain electrical isolation, together extending service life beyond what rubber alone can achieve.
Solution Approach 2:
Contact surfaces utilize curved or spherical geometries that distribute mechanical stress more evenly during repetitive testing, reducing localized wear and elasticity loss. This geometric optimization extends the functional life of the elastic components.
4Adaptability or versatility
If fine pitch device is tested, then device compatibility is achieved, but insulation distance becomes critical and short circuit risk increases
Solution Approach 1:
The contact array is segmented into individually isolated linear contact elements with optimized spacing. Each element maintains independent electrical isolation, allowing fine pitch configuration while preventing short circuits through controlled insulation distances between segments.
Solution Approach 2:
Insulating materials serve as intermediary elements between adjacent contact points in fine pitch configurations. These intermediaries maintain the necessary insulation distance while allowing the contacts to be positioned close enough for fine pitch device compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid-type contact and socket device provide stable electrical characteristics and extended service life, improving operational reliability and reducing costs by enhancing durability and maintaining performance in high-temperature burn-in tests, while being suitable for fine pitch devices with improved insulation and reduced risk of short circuits.
Implementation Method 1
a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together
Implementation Method 2
a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit
Data Source
AI summary
Disclosed are a hybrid-type contact and a socket device for testing a semiconductor device, in which the hybrid-type contact includes a first contact unit integrally configured by rolling a predetermined shaped strip pattern formed by blanking a metal plate into a cylindrical shape, a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit, and a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together, so as to compensate the disadvantages of conventional pin-type and rubber-type test socket devices, whereby it is easy to optimize the mechanical and electrical properties according to the requirements of the test device, and it is suitable for testing a fine pitch device.