Hybrid Converter Packaging With Split-Temperature Switching Stages
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Solution Overview
Problem
Existing power converters, particularly those based on silicon semiconductor devices, suffer from high power loss, large size, and high harmonic distortion, leading to inefficiency and increased implementation costs, which are exacerbated by the high cost of wide bandgap semiconductor materials like SiC and GaN.
Innovation Solution
A converter is divided into two circuit parts, with one part operating at a higher temperature and using wide bandgap semiconductor switches for high power loss operations, while the other part uses silicon semiconductor switches and lower-temperature materials, allowing for cost-effective implementation without compromising performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If wide bandgap semiconductor devices (SiC, GaN) are used to improve efficiency and performance, then power loss is reduced and efficiency is improved, but implementation cost increases significantly
Solution Approach 1:
The converter circuit is divided into two distinct circuit parts: a first circuit part using wide bandgap semiconductor devices (SiC/GaN) for high-frequency switching operations that benefit from low loss, and a second circuit part using conventional silicon semiconductor devices for operations where cost is more critical. This segmentation allows the system to achieve overall efficiency improvements while controlling implementation costs by applying expensive WBG technology only where it provides the most benefit.
Solution Approach 2:
Different semiconductor materials are applied to different circuit parts based on their specific operational requirements. The first circuit part uses wide bandgap materials optimized for high-frequency switching with low power loss, while the second circuit part uses conventional silicon materials where cost-effectiveness is prioritized. This local differentiation of material quality optimizes the balance between performance and cost.
2Ease of manufacture
If conventional silicon semiconductor devices are used to reduce cost, then implementation cost is reduced, but power loss increases and efficiency decreases
Solution Approach 1:
The converter is segmented into two circuit parts with different semiconductor technologies. The second circuit part uses conventional silicon devices to reduce implementation cost, while the first circuit part uses wide bandgap devices to compensate for the higher power loss, ensuring overall system efficiency remains high despite the cost-driven choice in the second part.
Solution Approach 2:
Conventional silicon semiconductor devices are applied locally in the second circuit part where cost is the primary concern, while wide bandgap devices are applied in the first circuit part to maintain overall system efficiency. This local application of different material qualities resolves the contradiction between cost reduction and efficiency maintenance.
3Device complexity
If two-level circuit topology is used to simplify design, then device complexity is reduced, but harmonic distortion increases and grid compatibility is compromised
Solution Approach 1:
The converter is divided into two circuit parts that can be configured with different topology complexities. The first circuit part may employ more complex multi-level topology to reduce harmonic distortion, while the second circuit part uses simpler two-level topology where complexity reduction is prioritized. This segmentation allows the system to achieve overall low harmonic distortion while maintaining manageable device complexity.
Data Source
AI summary
A converter comprises a first circuit part and a second circuit part configured to be electrically connected with each other. Each circuit part comprises two or more switches configured to be switched for the power conversion, the switches being semiconductor switches. The two or more switches of the first circuit part are configured for a first switching operation of the first circuit part. The two or more switches of the second circuit part are configured for a second switching operation of the second circuit part. The first switching operation causes a greater electrical power loss compared to the second switching operation. The two circuit parts are configured such that the first circuit part is configured to operate at a higher operating temperature compared to the second circuit part.