Hybrid Cooling Chassis for Electronic Equipment
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Solution Overview
Problem
Existing electronic equipment chassis designs face thermal challenges due to increased processing power and network bandwidth, with air and liquid cooling methods being insufficient for resource-intensive equipment, necessitating custom layouts and higher costs for liquid immersion cooling solutions.
Innovation Solution
The implementation of a hybrid cooling system within an electronic equipment chassis that integrates both liquid immersion cooling and non-liquid immersion cooling compartments, allowing for flexible installation in standard rack sizes and efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid immersion cooling is implemented for resource-intensive equipment, then cooling efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The chassis is divided into multiple cooling compartments, with at least one being a liquid immersion cooling compartment and others being non-liquid immersion cooling compartments. This segmentation allows different cooling methods to be applied to different equipment based on their thermal requirements, improving overall cooling efficiency while managing system complexity through modular design.
Solution Approach 2:
Different cooling methods are applied to different locations within the chassis based on the specific thermal needs of the equipment. Liquid immersion cooling is applied to resource-intensive equipment that generates high heat, while non-liquid immersion cooling is used for other equipment, optimizing cooling efficiency for each specific application.
2Temperature
If liquid immersion cooling is used, then thermal management is improved, but space requirements and installation complexity increase
Solution Approach 1:
The patent combines liquid immersion cooling and non-liquid immersion cooling compartments within a single chassis structure. This merging allows the system to achieve effective thermal management for resource-intensive equipment while maintaining a compact footprint that can be installed in standard data center racks, thereby reducing overall space requirements compared to dedicated liquid immersion cooling systems.
Solution Approach 2:
The chassis is designed as a multi-functional system that can accommodate both liquid immersion cooling and non-liquid immersion cooling methods, as well as support equipment with different cooling requirements. This universality allows a single chassis design to serve multiple cooling purposes, optimizing space utilization and reducing the need for separate cooling systems.
3Temperature
If custom layouts are designed for liquid immersion cooling, then cooling performance is optimized, but manufacturing cost and complexity increase
Solution Approach 1:
The chassis employs a universal design that can be manufactured using standard processes and then configured for different cooling applications. The modular compartment design allows the same basic chassis structure to support both liquid immersion and non-liquid immersion cooling, eliminating the need for expensive custom manufacturing while maintaining optimized cooling performance for different equipment types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This hybrid cooling approach enables efficient thermal management for resource-intensive equipment, reducing costs and space requirements by allowing liquid immersion cooling in standard data center racks, thereby optimizing cooling efficiency and scalability.
Implementation Method 1
The first type of cooling comprises liquid immersion cooling
Implementation Method 2
utilizes liquid immersion cooling for a first set of electronic equipment
Implementation Method 3
The second type of cooling comprises non-liquid immersion cooling
Implementation Method 4
utilizes non-liquid immersion cooling for a second set of electronic equipment
Data Source
AI summary
An electronic equipment chassis comprises a chassis housing and two or more cooling compartments in the chassis housing. At least a first one of the two or more cooling compartments in the chassis housing utilizes a first type of cooling for a first set of electronic equipment housed therein, and at least a second one of the two or more cooling compartments in the chassis housing utilizes a second type of cooling for a second set of electronic equipment housed therein. The first type of cooling comprises liquid immersion cooling and the second type of cooling comprises non-liquid immersion cooling.