Hybrid Cooling Architecture for High-Heat Computing Devices
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Solution Overview
Problem
Conventional cooling systems for computing devices face limitations in heat management, with air-cooled systems having limited cooling capacity and liquid-cooled systems requiring external infrastructure, which can lead to overheating and damage to heat-generating components.
Innovation Solution
A hybrid air-cooled and liquid-cooled cooling system is integrated into a single housing, where a heat sink is thermally connected to a heat-generating component, with heat pipes transferring heat to an air-cooled radiator and a liquid-cooled system using a cold plate and fluid piping to absorb additional heat, allowing for enhanced cooling without external infrastructure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air-cooled cooling system is used, then device complexity is reduced, but cooling capacity is insufficient
Solution Approach 1:
The patent combines air-cooled and liquid-cooled cooling systems into a hybrid architecture where the heat sink includes both air cooling fins and integrated liquid cooling channels. This merging allows the system to leverage the simplicity of air cooling while incorporating the high cooling capacity of liquid cooling, directly resolving the contradiction between device complexity and cooling capacity.
Solution Approach 2:
The heat sink is designed to perform multiple cooling functions simultaneously - it can operate in air-cooled mode using its fin structure, liquid-cooled mode using integrated channels, or hybrid mode combining both. This multi-functionality allows the same component to adapt to different cooling demands without requiring separate dedicated systems, maintaining simplicity while enhancing capacity.
2Reliability
If liquid-cooled cooling system is used, then cooling capacity is improved, but external infrastructure is required
Solution Approach 1:
By integrating liquid cooling channels directly into the heat sink structure rather than using external cooling loops, the patent eliminates the need for external infrastructure such as separate radiators, pumps, and coolant reservoirs. The liquid cooling system becomes self-contained within the device housing, maintaining high cooling capacity while improving adaptability to different deployment environments.
Solution Approach 2:
The liquid cooling channels are nested within the heat sink structure itself, with coolant flow paths embedded in the same component that provides structural support and air cooling functionality. This nesting eliminates the need for external cooling infrastructure while maintaining the high cooling capacity of liquid cooling systems.
3Reliability
If hybrid cooling system is implemented, then cooling capacity is enhanced, but device complexity increases
Solution Approach 1:
The air cooling fins and liquid cooling channels are merged into a single integrated heat sink component rather than being separate assemblies. This merging reduces the number of discrete parts, simplifies assembly, and lowers overall device complexity while maintaining the enhanced cooling capacity provided by the hybrid architecture.
Solution Approach 2:
The heat sink is designed as a universal component that performs both air cooling and liquid cooling functions through its multi-functional structure. By making the heat sink itself multi-functional rather than requiring separate dedicated cooling components, the patent enhances cooling capacity while minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid system provides improved cooling performance, enabling the use of higher-performing heat-generating components in any infrastructure, as it combines the strengths of both air and liquid cooling methods within a compact, self-contained unit.
Implementation Method 1
a heat pipe connecting the heat sink to the air-cooling radiator
Implementation Method 2
a cold plate thermally connected to or integrated into the hot plate
Data Source
AI summary
In some aspects, the techniques described herein relate to a cooling system for a computing device. The cooling system includes an air-cooled cooling system located in a housing. The air-cooled cooling system includes a heat sink thermally connected to a processor, an air-cooling radiator, and a heat pipe connecting the heat sink to the air-cooling radiator. The cooling system includes a liquid-cooled cooling system located in the housing. The liquid-cooled cooling system includes a cold plate thermally connected to a to the heat sink, a pump, a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator.