Hybrid Cooling System for Electronics Using Liquid Cold Plates
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Solution Overview
Problem
Conventional air-cooling methods for electronics systems face challenges in effectively managing increased heat dissipation in large server applications, leading to overheating, acoustic noise issues, and electromagnetic interference due to the need for high airflow rates and multiple air moving devices, which strain room air conditioning and create recirculation problems.
Innovation Solution
A hybrid cooling system combining air moving devices with a liquid-based cooling subsystem and a thermally conductive auxiliary structure featuring fins, which facilitates the passage of liquid coolant through cold plates coupled to primary heat generating components and extends thermally conductive fins over secondary heat generating components to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air flow rate is increased to cool high power modules, then cooling effectiveness is improved, but acoustic noise level and strain on room air conditioning increase
Solution Approach 1:
The cooling system is divided into multiple air moving devices, each serving specific drawers or sections, rather than using a single high-power device. This segmentation allows for more targeted and efficient cooling with reduced overall noise levels
Solution Approach 2:
The patent introduces liquid-based cooling subsystems with cold plates and coolant-carrying tubes to supplement air cooling. This hybrid approach uses liquid coolant circulation to handle heat loads that would otherwise require high-velocity air flow, thereby reducing acoustic noise while maintaining cooling effectiveness
2Temperature
If multiple air moving devices are used to cool large server farms, then cooling coverage is improved, but total acoustic noise and electromagnetic interference increase
Solution Approach 1:
Liquid-based cooling subsystems with cold plates and coolant-carrying tubes are introduced to supplement air cooling. This hybrid approach uses liquid coolant circulation to handle heat loads that would otherwise require high-velocity air flow, thereby reducing acoustic noise while maintaining cooling effectiveness
Solution Approach 2:
The system transitions from purely air-based cooling to a hybrid air-liquid cooling system, changing the thermal management parameter from gas-phase convection to liquid-phase heat transfer for certain components, reducing the number and power of air moving devices required
3Power
If air moving devices operate at higher RPM to handle increased power dissipation, then cooling capacity is improved, but acoustic noise becomes unacceptable
Solution Approach 1:
Liquid-based cooling subsystems with cold plates and coolant-carrying tubes are introduced to supplement air cooling. This hybrid approach uses liquid coolant circulation to handle heat loads that would otherwise require high-velocity air flow, thereby reducing acoustic noise while maintaining cooling effectiveness
Solution Approach 2:
The cooling system is divided into multiple air moving devices, each serving specific drawers or sections, rather than using a single high-power device. This segmentation allows for more targeted and efficient cooling with reduced overall noise levels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid cooling system effectively reduces the heat load on room air conditioning, minimizes acoustic noise, and improves cooling efficiency by leveraging both air and liquid cooling methods to manage high heat dissipation in multi-component electronics systems, thereby reducing the risk of overheating and electromagnetic interference.
Implementation Method 1
at least one cold plate coupled to the at least one primary heat generating component to be cooled for liquid-based cooling thereof
Implementation Method 2
facilitating passage of liquid coolant through one or more cold plates
Implementation Method 3
a thermally conductive auxiliary structure coupled to the at least one thermally conductive coolant-carrying tube, and includes a plurality of thermally conductive fins extending from a surface thereof
Implementation Method 4
an air moving device establishing air flow across multiple components of the electronics system
Data Source
AI summary
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.