Hybrid Cooling System for Electronic Racks
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Solution Overview
Problem
Conventional cooling systems are not cost-effective and fail to support dynamic configurations, power density variations, and performance optimization for high-density electronic racks in data centers, primarily focusing on facility energy efficiency rather than IT and rack performance.
Innovation Solution
A hybrid cooling system that combines air and liquid cooling, utilizing a coolant distribution unit with an enhancing cooling unit connected to a refrigeration loop to provide flexible and resilient cooling solutions for electronic racks, capable of dynamic configurations and temperature range adjustments, while maintaining low total cost of ownership.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If conventional cooling systems are used, then facility energy efficiency can be improved, but IT and rack performance optimization is not supported
Solution Approach 1:
The cooling system is divided into separate air cooling and liquid cooling subsystems, each optimized for specific components. Air cooling handles general rack cooling while liquid cooling targets high-density IT components, allowing independent optimization of each subsystem for both facility energy efficiency and IT performance.
Solution Approach 2:
Different cooling methods are applied to different locations and components based on their thermal requirements. High-density IT components receive liquid cooling for maximum performance, while other components use air cooling, enabling localized optimization of both energy efficiency and component performance.
2Device complexity
If conventional cooling systems are used, then single-type cooling is simplified, but dynamic configurations and power density variations cannot be supported
Solution Approach 1:
The cooling system is designed to perform multiple functions through a unified architecture that can switch between air cooling and liquid cooling modes. The system can adapt to different rack configurations, power densities, and component types without requiring complete system redesign, supporting dynamic configurations while maintaining manageable complexity.
Solution Approach 2:
The cooling system incorporates dynamic control capabilities that allow it to adjust cooling modes, fluid flow rates, and temperature setpoints based on real-time thermal conditions, rack configurations, and power density variations. This enables the system to adapt to changing requirements while maintaining operational simplicity through automated control.
3Temperature
If hybrid air and liquid cooling is implemented, then high-density components can be cooled effectively, but system complexity increases
Solution Approach 1:
The hybrid cooling system is segmented into distinct air cooling and liquid cooling pathways, each with dedicated components and control logic. This segmentation allows high-density components to receive intensive liquid cooling while other components use simpler air cooling, maintaining effective temperature control without requiring complete system redesign or excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages temperature ranges for high-performance components like CPUs and GPUs, enhancing energy efficiency and performance while providing flexibility and resilience, supporting various scenarios from component to system levels with reduced costs.
Implementation Method 1
an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a temperature lower than a temperature of the supplied cooling fluid through a refrigeration loop
Data Source
AI summary
A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU. The system further includes an air cooling unit to receive a second distributed portion of the cooling fluid and to use the second distributed portion of the cooling fluid to cool the airflow for IT rack or PoD. The system is arranged in five portions, and fluids and cooling units are shared among the portions within distributing loops.