Hybrid Cooling Architecture for Processor Thermal Limits
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Solution Overview
Problem
Existing cooling systems for computing devices often struggle to efficiently manage heat, particularly when air-cooled systems reach their thermal limits, potentially leading to device damage or performance degradation.
Innovation Solution
A hybrid air-cooled and liquid-cooled cooling system is integrated into a single housing, utilizing a heat sink thermally connected to a processor, heat pipes connecting the heat sink to an air-cooling radiator, and a liquid-cooled system with a cold plate, pump, and fluid radiator to absorb and dissipate excess heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an air-cooled cooling system is used, then the device structure is simple and easy to manufacture, but the cooling capacity is insufficient when heat-generating components reach thermal limits
Solution Approach 1:
The patent combines air-cooled and liquid-cooled cooling systems into a single hybrid cooling system. The air-cooled portion maintains structural simplicity and ease of manufacture, while the liquid-cooled portion (with cold plate and pump) provides enhanced cooling capacity for heat-generating components that exceed air-cooling thermal limits, thus resolving the contradiction between manufacturing simplicity and cooling effectiveness.
2Temperature
If a liquid-cooled cooling system is used, then the cooling capacity is enhanced, but external liquid cooling infrastructure is required
Solution Approach 1:
By merging air-cooled and liquid-cooled systems into a single integrated unit, the patent eliminates the need for external liquid cooling infrastructure. The liquid cooling components (cold plate, pump, fluid radiator) are contained within the device housing, providing enhanced cooling capacity while maintaining device self-containment and reducing external infrastructure requirements.
Solution Approach 2:
The hybrid cooling system is designed to be self-contained within the device housing, with the liquid cooling subsystem serving itself without requiring external infrastructure. The pump circulates coolant through the cold plate and fluid radiator internally, making the system independent of external liquid cooling infrastructure while maintaining enhanced cooling capacity.
3Temperature
If a hybrid cooling system is used, then the cooling capacity is enhanced beyond air-cooled limits, but the device complexity increases
Solution Approach 1:
The cooling system is segmented into distinct air-cooled and liquid-cooled portions, each optimized for specific thermal loads. The heat sink with heat pipes handles general cooling, while the cold plate provides targeted liquid cooling for high-heat components. This segmentation allows enhanced cooling capacity while managing complexity through functional separation and modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid cooling system effectively enhances the cooling capacity beyond what air-cooled systems can achieve, allowing for improved performance and reduced risk of damage from overheating, while also eliminating the need for external liquid cooling infrastructure.
Implementation Method 1
a heat pipe connecting the heat sink to the air-cooling radiator
Implementation Method 2
a cold plate thermally connected to a to the heat sink
Implementation Method 3
a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator
Data Source
AI summary
In some aspects, the techniques described herein relate to a cooling system for a computing device. The cooling system includes an air-cooled cooling system located in a housing. The air-cooled cooling system includes a heat sink thermally connected to a processor, an air-cooling radiator, and a heat pipe connecting the heat sink to the air-cooling radiator. The cooling system includes a liquid-cooled cooling system located in the housing. The liquid-cooled cooling system includes a cold plate thermally connected to a to the heat sink, a pump, a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator.