Hybrid Coupler Filter Layout for Multi-Passband Substrates
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Solution Overview
Problem
Existing filter devices with hybrid couplers require separate configurations for different passbands, leading to reduced productivity and increased complexity in manufacturing.
Innovation Solution
A filter device with a multilayer substrate and a hybrid coupler where part of the hybrid coupler is integrated in both the substrate and a chip, allowing adjustable operating frequency to match different passbands, enhancing productivity by using a common configuration for filters with varying passbands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate configurations are used for different passbands, then filtering performance is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent implements a universal multilayer substrate design that can support multiple different passbands through a single configuration. The substrate includes a common ground electrode structure and signal electrodes that can be configured for different frequency ranges, allowing one substrate to serve multiple filtering functions rather than requiring separate substrates for each passband.
Solution Approach 2:
The hybrid coupler is divided into multiple sections with different electrical characteristics along its length. By segmenting the coupler into sections with varying impedance or geometric parameters, a single substrate can accommodate multiple passband requirements through localized modifications rather than requiring complete separate designs.
2Reliability
If separate configurations are used for different passbands, then filtering performance is improved, but productivity decreases
Solution Approach 1:
The universal substrate design allows manufacturers to produce a single type of multilayer substrate that can be programmed or configured for different passbands, rather than maintaining multiple production lines for different substrate types. This increases manufacturing efficiency while maintaining the ability to deliver specialized filtering performance.
Solution Approach 2:
The patent enables different passband configurations by changing electrical parameters such as electrode dimensions, spacing, or material properties within the same substrate structure. This allows post-manufacturing adjustment or reconfiguration without requiring new substrate fabrication, thereby improving productivity.
3Productivity
If a common configuration is used for different passbands, then productivity is improved, but adaptability may be limited
Solution Approach 1:
The patent incorporates adjustable or reconfigurable elements within the hybrid coupler sections that allow the electrical characteristics to be modified after manufacturing. This dynamic capability enables a single common substrate configuration to adapt to different passband requirements, combining manufacturing efficiency with configuration flexibility.
Solution Approach 2:
Different sections of the hybrid coupler are designed with locally optimized properties that can be independently adjusted for specific passband requirements. This allows the overall common configuration to maintain productivity benefits while providing localized adaptability for different filtering applications.
Data Source
AI summary
A filter device includes a multilayer substrate, a chip mounted on the multilayer substrate, a first filter at least partially included in the chip, and a first hybrid coupler connected to the first filter. A part of the first hybrid coupler is included in the multilayer substrate, and another part of the first hybrid coupler is included in the chip.