Hybrid Datacentre Module Layout for Low-Latency Cooling Integration
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Solution Overview
Problem
Existing datacentre modules face limitations in computing power and environmental sustainability due to the integration of air-cooled and immersion-cooled server modules, which suffer from inefficient heat reuse and increased latency in data transfer.
Innovation Solution
A hybrid datacentre module integrating air-cooled and immersion-cooled server modules within a single housing, connected by a cooling device that efficiently transfers cooling fluid between them, allowing for low-latency data transfer and reuse of residual heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If immersion-cooled server modules are used to improve computing power, then computing performance is improved, but data transfer latency increases due to large distance from air-cooled storage modules
Solution Approach 1:
The patent combines immersion-cooled computing server modules and air-cooled storage server modules into a single integrated housing, merging previously separate cooling systems and physical locations. This integration reduces the spatial distance between computing and storage modules, thereby reducing data transfer latency while maintaining the high computing performance benefits of immersion cooling.
2Ease of operation
If air-cooled server modules are used, then ease of operation is maintained, but residual heat cannot be re-used efficiently for domestic heating
Solution Approach 1:
The patent converts the previously wasted residual heat from air-cooled server modules into a useful resource for domestic heating. By integrating a heating system that utilizes this residual heat, the invention transforms thermal energy that would otherwise be lost into a beneficial output, improving overall energy efficiency while maintaining the operational simplicity of air-cooled modules.
3Reliability
If separate cooling devices are used for air-cooled and immersion-cooled modules, then each module type can be optimized, but device complexity increases
Solution Approach 1:
The patent implements a multi-functional cooling device that serves both air-cooled and immersion-cooled server modules within the same housing. This universal cooling system performs multiple functions - cooling both module types simultaneously - thereby reducing the number of separate cooling devices needed and simplifying the overall system architecture while maintaining optimized cooling for each module type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid module achieves enhanced computing performance with reduced latency and increased energy efficiency by minimizing data transfer losses and effectively reusing thermal energy for domestic heating.
Implementation Method 1
a cooling device, configured to dissipate heat generated by the server modules out of the server housing
Data Source
AI summary
A hybrid datacentre module includes a server housing, one or more server modules arranged in an interior of the server housing, and a cooling device, configured to dissipate heat generated by the server modules out of the server housing. The server housing includes one or more server racks and the one or more server modules include one or more air-cooled server modules arranged in the one or more server racks. The cooling device is connected to the server housing and configured to guide a flow of cooling fluid, and the cooling device is configured to pump the cooling fluid into, and to extract the cooling fluid from the server housing. The one or more server modules further include one or more immersion-cooled server modules. The datacentre module further includes a wired data transfer connection between the air-cooled server modules and immersion-cooled server modules. The cooling device is further connected to the immersion-cooled server modules, and the cooling device is further configured to pump the cooling fluid from the server housing into, and to extract the cooling fluid from the immersion-cooled server modules.