Hybrid Dual Layer Ultrasound Transducer Array Impedance Matching
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Solution Overview
Problem
Current ultrasound transducer arrays face challenges in optimizing electrical impedance matching between transmit and receive circuitry, leading to reduced signal-to-noise ratio and imaging resolution due to parallel operation in transmit mode and isolated operation in receive mode, along with complex and costly interconnections.
Innovation Solution
A transducer array design where separate electrical signal connections are applied to individual receive elements for the receive operation, and a common connection is used for transmit operation, allowing independent optimization of transmit and receive circuitry and transducer design, with distinct acoustic and electrical impedance materials used for transmit and receive transducer elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common electrical connection is used for all transducer elements in transmit mode, then the transmit circuitry can be simplified and high voltage can be efficiently applied, but the electrical impedance matching becomes suboptimal and signal-to-noise ratio deteriorates in receive mode
Solution Approach 1:
The patent segments the electrical connections by implementing separate common connections for transmit mode and individual element connections for receive mode. This segmentation allows the transmit circuitry to use a simple common connection topology while the receive mode benefits from optimized individual element connections, thereby resolving the contradiction between circuit simplicity and signal quality.
Solution Approach 2:
The patent implements dynamic switching between transmit and receive connection configurations. During transmit mode, all elements are connected in parallel to the common transmit connection; during receive mode, the connections are reconfigured to provide individual element connections. This dynamic reconfiguration allows optimal impedance matching for each operational mode, resolving the contradiction between simplified transmit circuitry and optimized receive signal quality.
2Measurement precision
If transducer elements are tightly packed to achieve high imaging resolution, then imaging resolution is improved, but fabrication difficulty increases due to complex interconnections
Solution Approach 1:
The patent merges multiple transducer elements into a single integrated transducer unit with a common backing structure and shared electrical connections. This merging approach allows tight packing of elements to achieve high imaging resolution while simplifying fabrication by reducing the number of separate interconnections required, as multiple elements share common structural and electrical infrastructure.
3Device complexity
If low-voltage CMOS circuitry is used to reduce cost, then device cost is reduced, but the circuitry is vulnerable to damage from high transmit voltages
Solution Approach 1:
The patent segments the electrical connections to create isolated transmit and receive pathways. The high-voltage transmit signals are applied through dedicated transmit connections that are electrically isolated from the low-voltage CMOS receive circuitry. This segmentation allows the use of cost-effective low-voltage CMOS circuitry while protecting it from high-voltage damage through the isolated connection architecture.
Solution Approach 2:
The patent introduces an intermediary switching mechanism that mediates between the high-voltage transmit circuitry and the low-voltage CMOS receive circuitry. This intermediary switching system allows high-voltage signals to be applied to the transducer elements during transmit mode while preventing these high voltages from reaching the sensitive CMOS circuitry, thereby enabling the use of low-cost CMOS technology without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances signal-to-noise ratio and imaging resolution by optimizing impedance matching and reducing complexity and cost, while allowing for more flexible array configurations and improved imaging capabilities.
Implementation Method 1
Each transducer element comprises a piezoelectric material and two electrodes, one of which is a shared electrode. Voltages applied across the two electrodes of each transducer element induce acoustic waves to emanate from each transducer element, and acoustic waves applied to the receive transducer elements induce voltage signals on the electrodes with respect to the reference electrode.
Data Source
AI summary
An ultrasound transducer array having a transmit transducer element comprising a transmit transducer material interposed between a transmit electrode and a reference electrode, wherein voltages applied across the transmit electrode and reference electrode induce an acoustic wave to emanate from the transmit transducer material; and a plurality of receive transducer elements positioned in an array on the transmit transducer element, each of the plurality of the receive transducer elements comprising a receive electrode and a receive transducer material interposed between the receive electrode and the reference electrode, and wherein acoustic waves applied to the plurality of receive transducer elements induces receive voltage signals on the receive electrodes with respect to the reference electrode.