Hybrid Elastomer Socket for High TDP Power Delivery
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Solution Overview
Problem
Current socketed systems face challenges in meeting the power delivery requirements for high thermal design point (TDP) processors due to high path resistance (RPath), which is exacerbated by the socket's contribution to resistance, making it difficult to support future generations of processors.
Innovation Solution
The implementation of a hybrid elastomer socket system that combines conductive elastomer columns with additional power delivery paths, such as flexible printed circuit boards, to reduce RPath and directly connect power rail pins to a voltage regulator, thereby enhancing power delivery capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional socket structures are used to connect processors, then the system maintains simplicity and ease of assembly, but the path resistance (RPath) increases making it impossible to meet power delivery requirements for high TDP processors
Solution Approach 1:
The socket structure is segmented into multiple functional layers: traditional contact pins for basic connectivity, embedded flexible PCBs for additional power paths, and copper planes for low-resistance power distribution. This segmentation allows each layer to specialize in specific functions, collectively achieving the required power delivery capability for high TDP processors while maintaining modular assembly processes
Solution Approach 2:
The patent merges multiple power delivery mechanisms within a single socket structure: traditional pin contacts, flexible PCB traces, and copper planes are combined to create parallel power paths. This merging reduces overall path resistance by providing multiple concurrent routes for power flow, enabling the socket to meet the stringent power delivery requirements of high TDP processors
2Power
If the socket resistance is reduced to meet power delivery requirements, then power delivery capability improves, but the socket structure becomes more complex
Solution Approach 1:
The patent transitions from traditional two-dimensional pin-based power delivery to a three-dimensional multi-layer structure incorporating flexible PCBs and copper planes. This dimensional expansion creates additional power delivery pathways through different spatial layers, significantly reducing path resistance while distributing complexity across multiple functional zones within the socket assembly
3Productivity
If higher TDP processors are supported, then processing performance increases, but power delivery requirements exceed current socket capabilities
Solution Approach 1:
The socket incorporates flexible PCBs that can dynamically adapt to different processor power requirements. The flexible nature of the PCB allows for optimized power path configuration depending on the specific processor being installed, enabling the socket to scale power delivery capability to match the actual TDP requirements of various processor generations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces RPath and improves power delivery, enabling support for higher TDP processors by providing a more efficient and flexible power delivery system that meets the increasing demands of future processor generations.
Implementation Method 1
hybrid elastomer socket systems that provide power delivery capability
Implementation Method 2
conductive elastomer columns
Data Source
AI summary
A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.