Hybrid Electro-Optical Package for High-Bandwidth Cooling
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Solution Overview
Problem
High-speed electronic components, such as processors and network switches, are limited by bandwidth, and managing large numbers of optical waveguide connections in optical buses complicates cooling airflow, necessitating a simplified optical connection management solution.
Innovation Solution
A hybrid electro-optical package with a carrier substrate and package base that takes all connections, both optical and electrical, from the lower side, facilitating better cooling and management by using intra-package electrical interconnects and optical vias to communicate between the back and front sides, and a package interposer for connecting with a printed-circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If large numbers of optical waveguide connections are used in optical buses, then bandwidth is increased, but cooling airflow management becomes complicated
Solution Approach 1:
The patent moves optical connections from the top surface to the bottom side of the package, utilizing the z-dimension (vertical dimension) for optical via penetration. This dimensional reorganization allows optical connections to be made at the bottom alongside electrical connections, simplifying cooling airflow management at the top surface while maintaining high bandwidth through multiple optical channels.
2Temperature
If optical connections are made on the back side of the package, then cooling airflow is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines optical and electrical connections at the bottom side of the package, using the same carrier substrate and interconnect structure for both types of connections. Optical vias and electrical vias are integrated into the same substrate structure, and both connection types terminate at the same bottom surface, simplifying manufacturing by unified process flows rather than separate assembly operations.
3Ease of operation
If all connections (optical and electrical) are taken from the lower side, then optical connection management is simplified, but signal integrity challenges arise
Solution Approach 1:
The patent uses a carrier substrate as an intermediary structure that provides dedicated optical vias and electrical vias with appropriate shielding and isolation. The carrier substrate acts as a mediator between the optical components and electrical components, managing signal integrity through controlled impedance paths and electromagnetic shielding while enabling simplified bottom-side connections.
Data Source
AI summary
A hybrid electro-optical package for an opto-electronic engine. The package includes a carrier substrate, and a package base. Electrical vias and an optical via of the carrier substrate communicate between a back side and a front side of the carrier substrate. The package base is coupled to the carrier substrate by intra-package electrical interconnects. The carrier substrate is to interconnect electrically with an opto-electronic component mounted on its back side, and includes an optical aperture at its front side for communication of optical signals. Similarly, lands disposed at a front side of the package base provide for communication of electrical signals to an integrated circuit and the opto-electronic component. A system and an opto-electronic engine that include the hybrid electro-optical package are also provided.