Hybrid EM Simulation for PCB Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for simulating multi-layer printed circuit boards (PCBs) and package structures fail to accurately account for electromagnetic effects due to currents flowing through conductive planes, particularly in interactions between via pins and conductive planes, limiting the accuracy of electromagnetic analysis.
Innovation Solution
A hybrid electromagnetic simulation framework using mode decomposition, which includes solvers for parallel-plate, strip line, and microstrip line modes, defines ports for interconnect transitional components like via, strip line, and microstrip line, and computes network functions to characterize electrical properties, allowing for accurate simulation of electronic packaging structures with multiple conductive planes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mode decomposition method is used for electromagnetic simulation, then computational efficiency is improved, but frequency validity is limited to a few GHz
Solution Approach 1:
The simulation domain is segmented into multiple regions, each handled by specialized solvers: full-wave solvers for regions with significant electromagnetic radiation (higher frequencies), and mode decomposition solvers for regions with dominant guided modes (lower frequencies). This segmentation allows each solver to operate within its optimal frequency range, extending overall validity to tens of GHz while maintaining computational efficiency.
Solution Approach 2:
The methodology dynamically adjusts simulation parameters based on frequency content and regional characteristics. By changing the solver type and modeling approach according to the operating frequency and structural features, the system maintains accuracy across a broad frequency spectrum from low GHz to tens of GHz ranges.
2Measurement precision
If detailed 3D modeling of interconnects is implemented, then electromagnetic accuracy is improved, but computational complexity increases
Solution Approach 1:
Different levels of modeling detail are applied to different regions based on their electromagnetic significance. Critical interconnect regions with strong electromagnetic coupling use detailed 3D full-wave modeling, while less critical regions use simplified mode decomposition models. This localized approach maintains electromagnetic accuracy where needed while reducing overall computational complexity.
Solution Approach 2:
Mode decomposition models serve as intermediary representations between simplified circuit models and detailed 3D electromagnetic models. These intermediary models capture essential electromagnetic behavior of interconnects with reduced complexity, enabling accurate simulation without the full computational burden of detailed 3D modeling throughout the entire structure.
3Measurement precision
If interaction between via pins and conductive planes is fully modeled, then electromagnetic effect accuracy is improved, but simulation time increases
Solution Approach 1:
The simulation methodology dynamically selects the appropriate modeling approach for via-pin to conductive plane interactions based on frequency content and geometric configuration. At lower frequencies where quasi-static assumptions hold, simplified models are used; at higher frequencies where full electromagnetic coupling occurs, full-wave solvers are activated. This dynamic adaptation maintains accuracy while minimizing simulation time.
Solution Approach 2:
Full electromagnetic interaction modeling is applied selectively only to via pins and conductive planes where significant coupling occurs, rather than uniformly across all structures. By identifying and focusing computational resources on critical interaction regions, the methodology achieves accurate electromagnetic effect prediction without the excessive simulation time required for comprehensive full-wave analysis of all components.
Data Source
AI summary
Methods, systems, and computer-readable media for simulating an electronic packaging structure are disclosed. The methods include providing an electromagnetic simulation framework for simulating the electronic packaging structure that includes at least two planes and an interconnect transitional component. The framework includes solvers for simulation based on parallel-plate, strip line, and microstrip line modes. The method also includes defining ports of the component based on modes, computing a network function characterizing the properties of the component; and associating ports with solvers of the framework.