Hybrid Fiber Thermal Interface for Large Gap Heat Dissipation
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Solution Overview
Problem
Current thermal management techniques fail to efficiently connect heat-dissipating components to heatsinks across large gaps and non-flat surfaces, limiting processing capability and productivity due to low thermal conductivity and high pressure requirements, especially in densely packed electronic systems like single board computers and 2.5D/3D SiP packages.
Innovation Solution
A thermal electrical interface system using a hybrid fiber thermal interface with a compressible core, such as shape memory polymers, metal wool, or metal foams, to create a flexible and conductive thermal pathway that can span large gaps and conform to varying surface heights, enhancing heat dissipation and electrical interfacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If large thickness thermal gap pads are used to span large gaps, then the gap distance is covered, but thermal conductivity is limited to 2 W/m-K or less and high pressure above 50 psi is required
Solution Approach 1:
The patent uses composite thermal interface materials combining multiple layers with different properties: a compressible foam layer for gap filling, a phase change material layer for thermal conduction, and a rigid heatsink interface layer. This composite structure achieves both large gap coverage and high thermal conductivity without requiring excessive pressure
Solution Approach 2:
The patent employs phase change materials that transition from solid to liquid state under operating temperature, changing their thermal and mechanical properties dynamically. This allows the material to flow and fill gaps effectively while maintaining high thermal conductivity at operating conditions
2Adaptability or versatility
If flexible thermal interface materials are used to interface with non-flat surfaces, then adaptability to curved surfaces is improved, but thermal conductivity remains below 2 W/m-K and pressure exceeds 50 psi
Solution Approach 1:
The patent uses thin, flexible metal foil layers with high thermal conductivity as the heatsink interface. These thin films are highly conformable to non-flat surfaces while maintaining excellent thermal conduction properties, eliminating the need for thick, low-conductivity flexible materials
Solution Approach 2:
The combination of compressible foam (for conformity) with thin metal foil layers (for thermal conduction) creates a composite structure that achieves both surface adaptability and high thermal conductivity without requiring high pressure
3Reliability
If metal sheets and bars are used to create thermal pathways, then thermal conductivity is improved, but they cannot reach critical components like CPUs and do not include all heat-dissipating components
Solution Approach 1:
The patent designs a universal thermal interface system that can accommodate multiple component types (CPUs, GPUs, memory, storage) with varying heights and thermal requirements through a single composite TIM structure, eliminating the need for separate thermal solutions for each component
Solution Approach 2:
The composite TIM structure provides different local properties: high compliance regions for gap filling, high thermal conductivity regions for heat transfer, and phase change regions for adaptive conformability, allowing each area of the interface to be optimized for its specific function
4Loss of energy
If external forced air cooling is used to actively cool SBC cases, then heat dissipation is improved, but device complexity and noise increase
Solution Approach 1:
The patent extracts the active cooling mechanism (fan/forced air) from the system and replaces it with passive thermal conduction through composite TIMs and heatsinks, eliminating moving parts while maintaining effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively increases thermal conductivity and reduces mechanical stress, enabling efficient heat dissipation across large gaps and non-flat surfaces, thereby improving processing capability and reducing the risk of component damage.
Implementation Method 1
A thermal electrical interface system using a hybrid fiber thermal interface with a compressible core, such as shape memory polymers, metal wool, or metal foams, to create a flexible and conductive thermal pathway
Implementation Method 2
the system effectively increases thermal conductivity and reduces mechanical stress, enabling efficient heat dissipation across large gaps and non-flat surfaces
Implementation Method 3
A thermal electrical interface system using a hybrid fiber thermal interface with a compressible core, such as shape memory polymers
Data Source
AI summary
A thermal electrical (TE) interface comprises a primary fiber thermal interface (FTI) having a first side configured to contact a heatsink, and a second side. The primary fiber thermal interface has a thickness ranging from 0.3 mm to 4 mm. A secondary fiber thermal interface (FTI) has a first side configured to contact the second side of the primary FTI, a second side configured to contact circuit components to dissipate heat from the circuit components through the first side of the primary FTI. The secondary fiber thermal interface has a thickness equal to or greater than the primary FTI.