Hybrid Filter Layout Using Overlapped Acoustic and Passive Components
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Solution Overview
Problem
The increasing demand for miniaturization and higher integration in mobile communication devices has led to a challenge in reducing the size of hybrid filter devices, which typically consist of an acoustic wave device and a passive device arranged side by side on a substrate, resulting in an enlarged device size.
Innovation Solution
The hybrid filter device is configured with the acoustic wave device and passive device overlapping each other when viewed perpendicular to the substrate, with electrical connection via a connection conductor extending perpendicular to the substrate, allowing for reduced size and minimized wiring line length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the acoustic wave device and passive device are arranged side by side on the substrate, then the electrical connection between them is simplified, but the size of the hybrid filter device is increased
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional overlapping arrangement. The acoustic wave device and passive device are positioned at different heights (first height and second height respectively) and overlap when viewed from above, utilizing the vertical dimension to reduce the horizontal footprint of the hybrid filter device while maintaining electrical connection simplicity through conductors extending between the devices at different levels
2Ease of manufacture
If the acoustic wave device and passive device are arranged side by side on the substrate, then the wiring layout is simplified, but the device area is increased
Solution Approach 1:
The patent employs vertical stacking with the acoustic wave device at a first height and the passive device at a second height, allowing wiring to connect between layers rather than requiring extensive lateral routing. This three-dimensional wiring approach reduces the horizontal device area while maintaining manufacturing feasibility through standard multi-layer PCB or substrate wiring techniques
3Reliability
If the acoustic wave device and passive device are arranged side by side, then the electrical connection path is direct, but the wiring line length is increased leading to higher loss
Solution Approach 1:
By positioning the acoustic wave device and passive device at different heights with overlapping horizontal projections, the patent enables shorter vertical or diagonal connection paths between the devices. This reduces the total conductor length required for electrical connection compared to side-by-side arrangements, thereby reducing resistive losses while maintaining connection reliability through proper impedance control and shielding in the vertical routing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size of the hybrid filter device while minimizing wiring line loss and maintaining high-frequency pass band performance with steep attenuation slopes.
Implementation Method 1
an acoustic wave device including an acoustic wave resonator
Data Source
AI summary
A hybrid filter device (1) includes an acoustic wave device (AD) that includes an acoustic wave resonator and a passive device (PD) that includes an inductor element or an inductor element and a capacitance element. At least one of the acoustic wave device (AD) and the passive device (PD) is mounted on a substrate (20) of the hybrid filter device (1) and the acoustic wave device (AD) and the passive device (PD) are electrically connected to each other. The acoustic wave device (AD) overlaps the passive device (PD) when the hybrid filter device (1) is viewed in a direction perpendicular to one main surface (20a) of the substrate (20).