Hybrid Flex Microcoax Interconnect for Long-Distance Signal Integrity

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Solution Overview

Problem

Existing electronic devices face challenges in transferring high-speed data over long distances within the device due to signal degradation and electromagnetic interference, particularly when circuits are spaced apart and have intervening components, necessitating flexible and easily manufacturable interconnect solutions.

Innovation Solution

The implementation of microcoaxial cables in a hybrid flex circuit board, comprising a center conductor, insulating layer, and outer shield, secured by a polyimide layer, with conductive layers and additional conductors for power and ground, allowing for flexible and high-speed data transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional flexible circuit boards are used for data transmission, then the interconnect can be easily manufactured and routed, but signal degradation and electromagnetic interference increase over distance

Engineering Contradiction:
Improvesignal integrityVSAvoidtransmission distance
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The circuit board is divided into two distinct types of interconnects: rigid strip-line traces for short-distance connections and flexible microcoaxial cables for long-distance connections. This segmentation allows each interconnect type to be optimized for its specific function, with microcoaxial cables providing superior signal integrity over extended distances while strip-lines handling local routing needs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Microcoaxial cables are introduced as an intermediary solution between the processor and distant components. These cables act as a mediator that maintains signal integrity over long distances where conventional flexible circuit boards would fail, effectively bridging the gap between short-distance rigid traces and long-distance transmission requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If strip-line techniques are used to reduce electromagnetic interference, then signal integrity improves, but manufacturing complexity and assembly difficulty increase

Engineering Contradiction:
Improvesignal integrityVSAvoidassembly ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The interconnect system is segmented into rigid strip-line portions for local connections and pre-fabricated microcoaxial cable assemblies for long-distance connections. This segmentation allows the complex microcoaxial cables to be manufactured and tested separately as complete assemblies, then simply plugged into the circuit board, reducing overall manufacturing complexity compared to attempting to integrate shielding and routing throughout the entire board.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Microcoaxial cables are pre-fabricated, pre-shielded, and pre-assembled with connectors before being integrated into the circuit board. This preliminary action of preparing the cables separately allows for quality control and testing to be performed on the cable assemblies independently, simplifying the final board assembly process while maintaining signal integrity.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If circuits are placed at a distance from each other, then component layout flexibility increases, but data transmission difficulty increases due to signal degradation

Engineering Contradiction:
Improvelayout flexibilityVSAvoiddata transmission quality
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The circuit board employs a hybrid interconnect architecture where rigid strip-lines handle short-distance local connections and flexible microcoaxial cables handle long-distance connections. This segmentation enables components to be placed at various distances and positions, with the appropriate interconnect type selected based on distance requirements, thereby providing layout flexibility without compromising transmission quality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system changes the physical parameters of the interconnect based on transmission distance requirements. For short distances, rigid strip-lines with controlled impedance are used; for long distances, flexible microcoaxial cables with superior shielding and lower signal loss characteristics are deployed. This parameter-based selection allows optimal performance across varying layout configurations.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If microcoaxial cables are used for long-distance transmission, then signal integrity is maintained, but device complexity and assembly steps increase

Engineering Contradiction:
Improvesignal integrityVSAvoidinterconnect structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The circuit board is segmented into zones served by different interconnect types: rigid strip-lines for local connections and flexible microcoaxial cables for distant connections. This segmentation concentrates the complexity of microcoaxial cable integration only where long-distance transmission is required, rather than complicating the entire board design, thereby maintaining signal integrity for long-distance paths while keeping overall device complexity manageable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The circuit board design integrates multiple interconnect types into a unified hybrid architecture that serves both short-distance and long-distance transmission needs. This multi-functional approach allows the same board to handle various transmission distances and signal requirements using the most appropriate interconnect type for each specific connection, optimizing performance without requiring entirely separate designs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hybrid flex circuit board enables high-speed data transmission over extended distances with reduced electromagnetic interference, maintaining signal integrity and ease of assembly, suitable for various electronic devices.

Implementation Method 1

microcoaxial cables, referred to here as microcoax cables, in a hybrid flex circuit board, which can be referred to as a hybrid flex. This hybrid flex can be used to convey signals an extended distance within an electronic device

Methodology Applied
Scientific EffectElectromagnetic signal transmission: Electromagnetic Induction

Implementation Method 2

The microcoax cables can include a center conductor, an insulating layer, and an outside shield layer

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 3

The cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 4

The microcoax and other conductors can be soldered to a printed circuit board, flexible circuit board, or other substrate using jet soldering

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS20250112383A1Extended-range high-speed interconnect
Publication Date: 2025.04.03 APPLE INC
  • US20250112383A1 patent drawing
  • US20250112383A1 patent drawing
  • US20250112383A1 patent drawing

AI summary

Examples can provide extended-range high-speed interconnect by providing microcoax cables in a hybrid flexible circuit board, which can be referred to as a hybrid flex or microcoax flex. This hybrid flex can be used to convey signals an extended distance within an electronic device. Multiple signals can be conveyed using corresponding microcoax cables. The microcoax cables can include a center conductor, an insulating layer, and an outside shield layer. The cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer. Copper layers can be provided on either or both the top and bottom of the polyimide or other insulative layer. Additional conductors can be embedded in the polyimide other insulative layer to convey power and ground. The microcoax and other conductors can be soldered to a flexible circuit board or other substrate using jet soldering.