Hybrid Flexible Electronics Integrating Rigid ICs on Polymer Substrates

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Solution Overview

Problem

Flexible electronics suffer from lower degrees of integration, limited performance, and larger parameter variations compared to silicon technology, hindering their ability to implement complex systems like multiprocessor systems-on-chip with competitive power and performance.

Innovation Solution

The integration of silicon ICs for high processing and storage capabilities with flexible electronics for flexibility, utilizing Systems-on-Polymer architectures and optimizing the placement of rigid ICs on flexible substrates to minimize flexibility loss, while considering flexibility as a new design metric alongside power, performance, and area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If flexible electronics are used instead of silicon technology, then flexibility, weight, and manufacturing cost are improved, but integration degree, performance, and parameter stability deteriorate

Engineering Contradiction:

ImproveflexibilityVSAvoidintegration degree

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines flexible electronics and rigid silicon ICs into a hybrid system, merging the advantages of both technologies. The rigid ICs provide high integration and performance, while the flexible substrate provides adaptability and conformability, resolving the contradiction between flexibility and integration degree

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses composite material structures including flexible substrates, encapsulation layers, and rigid IC components. This composite approach allows the system to simultaneously achieve flexibility from the substrate and high integration from the rigid ICs, addressing the trade-off between adaptability and device complexity

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If flexible electronics are used instead of silicon technology, then flexibility, weight, and manufacturing cost are improved, but performance and parameter stability deteriorate

Engineering Contradiction:

ImproveflexibilityVSAvoidparameter stability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The hybrid architecture merges flexible components with rigid silicon ICs that offer superior parameter stability and reliability. The rigid ICs handle functions requiring precise electrical characteristics, while flexible components provide mechanical adaptability, thus resolving the contradiction between flexibility and parameter stability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent applies different material properties to different parts of the system: rigid materials for regions requiring electrical stability and flexible materials for regions requiring mechanical adaptability. This local differentiation allows the system to achieve both flexibility and parameter stability simultaneously

Inventive Principle:

Principle #3Local quality

3Productivity

If rigid ICs are integrated on flexible substrates, then processing and storage capabilities are improved, but flexibility is reduced

Engineering Contradiction:

Improveprocessing capabilityVSAvoidflexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent uses thin flexible substrates and encapsulation films to minimize the mechanical impact of rigid ICs. The thin-film structure allows the rigid components to be integrated while maintaining overall system flexibility, resolving the contradiction between processing capability and flexibility

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent transitions from planar integration to three-dimensional stacking and vertical integration. By utilizing the vertical dimension, the system achieves high processing capability through layered architectures while maintaining flexibility in the lateral dimensions, thus resolving the contradiction between productivity and adaptability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Device complexity

If more rigid ICs are placed on flexible substrates, then integration and performance are improved, but flexibility loss increases

Engineering Contradiction:

ImproveintegrationVSAvoidflexibility

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent employs nested integration where multiple rigid ICs are stacked vertically or arranged in compact three-dimensional configurations. This nesting approach maximizes integration density while minimizing the lateral footprint, thereby preserving flexibility. The nested structure allows high integration without proportionally increasing flexibility loss

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS9984962B2Systems and methods for hybrid flexible electronics with rigid integrated circuits

Publication Date: 2018.05.29 THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIV OF ARIZONA

AI summary

Systems and methods for flexible hybrid electronic (FHE) systems integrate traditional rigid integrated circuits with flexible substrates and/or interconnects. The layout and components of the system may be selected and/or optimized for a desired level of performance or flexibility. Via use of exemplary FHE system principles, improved wearable devices and other portable electronic systems may be realized.