Hybrid Glass Substrate With Organic Frame for Crack-Resistant Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Glass substrates, due to their fragility, are prone to chips, cracks, and fractures during processing, especially in large, thin panels used in advanced packaging solutions, posing challenges for compatibility with existing organic toolsets and increasing costs and reducing yield.
Innovation Solution
Hybrid glass and organic substrates are developed, featuring a glass core with an organic frame or shell, which can be processed using existing organic toolsets, with methods including a copper-clad laminate frame, organic polymer frame, adhesive bonding, prepreg reinforcement, and interlocking frame designs to enhance protection and processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass substrates are used to replace organic materials, then thermal stability and electrical properties are improved, but fragility increases leading to chips and cracks during processing
Solution Approach 1:
The patent creates a hybrid substrate by bonding a glass core to an organic carrier substrate. This composite structure combines the thermal stability and electrical properties of glass with the mechanical strength and flexibility of organic materials, resolving the contradiction between improved thermal performance and increased fragility.
2Shape
If thin glass panels are used for advanced packaging, then distortion-free surface is improved, but susceptibility to damage increases
Solution Approach 1:
The substrate is segmented into two functional parts: a thin glass layer providing the distortion-free surface and an organic carrier substrate providing mechanical support. This segmentation allows each material to perform its optimal function without compromising the other.
Solution Approach 2:
The organic carrier substrate acts as an intermediary that protects the thin glass layer from mechanical damage during handling and processing, while allowing the glass to maintain its flat, distortion-free surface for packaging applications.
3Reliability
If glass processing toolsets are developed, then glass damage is reduced, but cost and complexity increase
Solution Approach 1:
The hybrid substrate design allows existing organic substrate processing toolsets to handle the glass-containing substrate without modification. The organic carrier substrate enables compatibility with legacy equipment, avoiding the need for expensive new glass-specific processing tools.
4Reliability
If glass processing toolsets are developed, then damage reduction is achieved, but cost increases
Solution Approach 1:
The organic carrier substrate serves as a mediator that enables the use of existing, cost-effective processing equipment. By maintaining compatibility with legacy toolsets, the overall manufacturing cost is reduced compared to developing entirely new glass processing infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid substrates provide higher yield and lower costs by protecting glass cores from damage, supporting well-established processes, and maintaining the benefits of glass cores over organic alternatives, such as copper-clad laminates, while ensuring compatibility with legacy toolsets.
Implementation Method 1
a glass core with an organic frame or shell, which can be processed using existing organic toolsets, with methods including a copper-clad laminate frame, organic polymer frame, adhesive bonding, prepreg reinforcement, and interlocking frame designs to enhance protection and processability
Implementation Method 2
adhesive bonding
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 2D~2E
AI summary
Hybrid glass and organic substrates, devices and systems formed thereon, and methods of forming the same, are disclosed herein. In one example, a substrate includes a glass layer and an organic frame around the glass layer, where the organic frame includes a polyimide.