Hybrid Heat Dissipation Structure for Heterogeneous Chip Packages
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Solution Overview
Problem
High-performance computing (HPC) applications face challenges with thermal management due to increased power density and heat generation, including thermal cross-talk, height differences, additive thermal resistance, thermal-induced deformations, and thermal throttling, which existing thermal management systems, including water-cooling heat sinks, are unable to effectively address.
Innovation Solution
An Integrated Hybrid Heat Dissipation System (IHHDS) is developed, featuring a die-mounted substrate with a flip-chip solder ball connection, an integrated heat spreader with a thin flexible foil and stress-absorbing mechanism, a high-temperature durable bonding material, and a heat sink with vents and microjet impingement mechanism to enhance heat dissipation and accommodate thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water-cooling heat sink is applied, then heat dissipation capability is improved, but thermal cross-talk between neighboring silicon components occurs
Solution Approach 1:
The heat sink is divided into multiple independent cooling channels, each serving specific silicon components. This segmentation prevents thermal cross-talk by isolating the thermal paths for different components while maintaining effective heat dissipation for each individual component.
Solution Approach 2:
Different regions of the heat sink are designed with customized thermal characteristics to match the specific heat generation patterns of different silicon components. This localized optimization ensures efficient heat dissipation for each component without causing thermal interference to neighboring components.
2Productivity
If heterogeneous chips integration is implemented, then computing performance is improved, but height differences between heterogeneous components cause thermal management challenges
Solution Approach 1:
The patent transitions from a traditional planar heat sink design to a three-dimensional stacked heat sink architecture. This vertical stacking approach accommodates the height differences of heterogeneous components by providing multi-level cooling surfaces that align with components at different elevations, enabling effective thermal management in the vertical dimension.
3Productivity
If multiple stacked silicon dies are used, then computing capability is improved, but additive thermal resistance increases
Solution Approach 1:
The patent introduces thermally conductive intermediary materials between stacked silicon dies to facilitate heat transfer from upper dies to lower dies and ultimately to the heat sink. These intermediary materials reduce the additive thermal resistance that would otherwise accumulate at each interface between stacked dies.
4Area of stationary object
If large package dimension is used, then heterogeneous integration is enabled, but thermal-induced deformations occur
Solution Approach 1:
The patent modifies the thermal and mechanical parameters of the heat sink and package materials to match the coefficient of thermal expansion (CTE) of the heterogeneous components. By adjusting these parameters, the system accommodates large package dimensions while minimizing thermal-induced deformations and stress through optimized thermal expansion characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IHHDS provides more efficient and reliable transient thermal management, effectively addressing the challenges of high thermal design power and power density in HPC applications by maximizing heat dissipation and minimizing thermal throttling.
Implementation Method 1
the heat generated from the die is conducted through the thermal interface material to the heat sink
Implementation Method 2
the vents in the heat sink can accommodate the expansion or shrinkage of the thermal interface material during thermal cycling
Implementation Method 3
a heat sink fixed and attached to the heat sink supporter, wherein the backside of the heat sink is provided with vents
Implementation Method 4
a heat sink fixed and attached to the heat sink supporter, wherein the backside of the heat sink is provided with vents
Data Source
AI summary
A semiconductor package comprises a die mounted on a substrate by flip-chip solder balls; an integrated heat spreader including a thin flexible foil and a supporter; a high temperature durable bonding material applied to the backside of the integrated heat spreader to bond the backside of the integrated heat spreader to the die; a heat sink fixed and attached to the heat sink supporter, wherein the backside of the heat sink is provided with vents and the backside of the heat sink, the integrated heat spreader and the exposed major portion of the die together define a cavity-like container portion; and a thermal interface material applied within the cavity-like container portion, wherein the heat generated from the die is conducted through the thermal interface material to the heat sink, and the vents in the heat sink can accommodate the expansion or shrinkage of the thermal interface material during thermal cycling.