Hybrid IC Package Heat Spreader Layout for Better Heat Dissipation
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Solution Overview
Problem
Current integrated circuit packages with mixed assembly technologies, such as flip chip and wire bond-based dies, face limited heat dissipation due to the low thermal conductivity of mold compounds, which restricts the efficiency of heat transfer to heat sinks.
Innovation Solution
Incorporating thermally conductive elements and materials within the package to enhance heat dissipation, including the use of heat spreaders and thermally conductive materials on the surface, to facilitate better heat transfer from dies to a heat sink or package-level heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mold compound is used to encapsulate dies in a package, then the dies are protected and structurally supported, but heat dissipation is limited due to the low thermal conductivity of the mold compound
Solution Approach 1:
The package is divided into multiple encapsulation regions: a first mold compound encapsulates the first die, while a second mold compound with higher thermal conductivity encapsulates the second die. This segmentation allows different thermal management strategies for different dies within the same package.
Solution Approach 2:
Different regions of the package are assigned different material properties. The second mold compound surrounding the second die has higher thermal conductivity than the first mold compound, creating localized thermal pathways tailored to the specific thermal management needs of each die.
2Temperature
If a heat sink with thermal interface material is placed above the molded package, then heat can be dissipated from the package surface, but the low thermal conductivity of the mold compound locks heat inside the package
Solution Approach 1:
The second mold compound with higher thermal conductivity is strategically placed around the second die to create a localized thermal pathway that efficiently conducts heat from the die to the heat sink, while the first mold compound maintains its protective function.
Solution Approach 2:
The package uses composite material construction with two different mold compounds having distinct thermal conductivity properties. This composite approach combines the protective qualities of the first mold compound with the thermal management capabilities of the second mold compound.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient heat dissipation in hybrid packages with different attachment technologies, improving thermal management and reducing junction temperatures of dies, thereby enhancing the overall efficiency and performance of computing devices.
Implementation Method 1
the low thermal conductivity of the mold compound, since the mold compound effectively locks the heat inside the package
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
In one embodiment, an integrated circuit package includes a package substrate, a first integrated circuit die electrically coupled to the package substrate via wire bond connectors, and a second integrated circuit die coupled to the package substrate. The package further includes a heat spreader coupled to the first integrated circuit die via a thermal interface material (TIM) and a dielectric material encompassing the first integrated circuit die and the second integrated circuit die on the package substrate. A top surface of the heat spreader is aligned with a top surface of the dielectric material.