Hybrid IC Package Layout Using Waveguides for Low-Loss Signal Paths

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Solution Overview

Problem

Existing hybrid integrated circuit packages face challenges with high insertion losses and cross-talk in long signal paths, particularly in large packages used for high-performance computing applications, which affect data transfer rates and latency.

Innovation Solution

The integration of photonic and electrical signal paths through a hybrid redistribution structure that includes metallization patterns and waveguides, reducing the need for conductive features and enhancing signal routing, thereby minimizing insertion losses and cross-talk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If electrical signal paths are used for long-range transmission in large packages, then signal transmission is achieved, but insertion losses and cross-talk increase

Engineering Contradiction:

Improveinsertion lossVSAvoidsignal path length

Core Design Contradiction:

Loss of energyVSLength of moving object

Solution Approach 1:

The patent replaces electrical signal transmission with optical signal transmission for long-range connections within the package. Optical interconnects substitute for traditional electrical conductors, enabling long-distance signal transmission with significantly reduced insertion losses and cross-talk, thereby resolving the contradiction between transmission distance and signal quality.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If more conductive features are added to extend signal paths, then connectivity is improved, but cross-talk and insertion losses worsen

Engineering Contradiction:

Improvesignal routing connectivityVSAvoidcross-talk

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent substitutes optical waveguides for electrical conductors in signal routing applications. This replacement eliminates the electromagnetic interference and cross-talk inherent in electrical systems while maintaining the ability to provide complex signal routing and connectivity patterns throughout the package structure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Loss of energy

If optical components are integrated for long-range transmission, then insertion losses are reduced, but device complexity increases

Engineering Contradiction:

Improveinsertion lossVSAvoidpackage structure complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent divides the signal transmission system into distinct segments: electrical interconnects for short-range connections and optical interconnects for long-range connections. This segmentation allows each subsystem to operate in its optimal performance range, reducing overall insertion losses while managing complexity through functional separation rather than universal optical integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The hybrid interconnect structure serves multiple functions: it provides both electrical and optical signal transmission capabilities within a single package architecture. This multi-functionality allows the system to optimize for different transmission distances and signal types without requiring separate package designs, thereby managing complexity while achieving low insertion losses.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach increases data transfer rates and reduces latency in high-performance computing applications by utilizing photonic features for long connections, improving manufacturing yield and flexibility.

Implementation Method 1

a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the first dielectric layer and the second photonic die

Methodology Applied

Scientific EffectOptical coupling: Optical Fibre

Data Source

PatentUS20250316664A1Hybrid integrated circuit packages

Publication Date: 2025.10.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An embodiment device includes: a first dielectric layer; a first photonic die and a second photonic die disposed adjacent a first side of the first dielectric layer; a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the first dielectric layer and the second photonic die; a first integrated circuit die and a second integrated circuit die disposed adjacent the first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a second side of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; and a second dielectric layer disposed adjacent the second side of the first dielectric layer.