Flexible Hybrid Interconnect Layout for Shielded HF Signal and Power
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Solution Overview
Problem
Conventional interconnect circuits face challenges in transmitting high-frequency alternating current signals due to the need for precise impedance control and are prone to electromagnetic interference and crosstalk, requiring separate circuits for power and signal transmission, which limits their flexibility and efficiency.
Innovation Solution
Flexible hybrid interconnect circuits are developed, comprising multiple conductive layers with one or more conductive elements acting as high-frequency signal lines, surrounded by electromagnetic shields, and additional conductive elements for power transmission, all supported by dielectric layers, allowing for conformal attachment to non-planar surfaces and efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If separate circuits are used for power and signal transmission, then electromagnetic interference and crosstalk are reduced, but device complexity and weight increase
Solution Approach 1:
The patent combines power transmission and signal transmission functions into a single hybrid interconnect circuit. The circuit includes power conductors for electrical power transmission and signal conductors for high-frequency signal transmission, all integrated within the same flexible circuit structure. This merging eliminates the need for separate power and signal circuits, reducing overall device complexity and weight while maintaining electromagnetic interference protection through integrated shielding layers.
Solution Approach 2:
The patent employs electromagnetic shielding layers that convert potential electromagnetic interference into a beneficial protective mechanism. The shielding layers are strategically positioned between signal conductors and power conductors, as well as surrounding signal conductors, to absorb and redirect electromagnetic fields. This transforms the harmful electromagnetic interference that would normally require separate circuits into a controlled protective feature within the integrated hybrid circuit.
2Ease of manufacture
If conventional interconnect circuits are used, then manufacturing is simpler, but high-frequency signal transmission precision and impedance control are insufficient
Solution Approach 1:
The patent achieves precise impedance control for high-frequency signal transmission by carefully controlling the geometric parameters of the signal conductors and the dielectric properties of the surrounding materials. The signal conductors are positioned at specific distances from reference planes and power conductors, with controlled dielectric layer thicknesses, to maintain characteristic impedance values suitable for high-frequency operation. These parameter controls are achieved through standard flexible circuit manufacturing processes, maintaining ease of manufacture while achieving the required precision.
Solution Approach 2:
The patent applies different structural configurations to different regions of the hybrid interconnect circuit to optimize local performance. Signal transmission regions feature controlled impedance geometries with specific dielectric spacing and shielding arrangements, while power transmission regions use broader conductor configurations suitable for high current carrying capacity. This local differentiation allows each region to be optimized for its specific function while using the same manufacturing process.
3Reliability
If multiple separate circuits are used for power and signal, then transmission reliability is improved, but weight and size increase
Solution Approach 1:
The patent merges power transmission and signal transmission into a single hybrid interconnect circuit, significantly reducing the total weight compared to separate circuits. The flexible circuit substrate and supporting structures are shared between power and signal pathways, eliminating redundant materials. The integrated design maintains transmission reliability through proper electromagnetic shielding and signal isolation techniques within the unified circuit structure.
Solution Approach 2:
The patent employs composite material structures in the hybrid interconnect circuit, combining conductive layers for power and signal transmission with dielectric layers for insulation and mechanical support. The use of flexible circuit materials allows the circuit to conform to various shapes while maintaining electrical performance, reducing the need for additional rigid support structures and further minimizing weight.
4Object-affected harmful factors
If HF signal lines are surrounded by electromagnetic shields, then electromagnetic interference is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent integrates electromagnetic shielding layers directly into the flexible circuit manufacturing process, combining the shielding function with the existing multi-layer circuit board construction. The shielding layers are formed as part of the standard lamination process, using the same adhesive bonding and layer stacking techniques already employed for creating the flexible circuit. This integration avoids the need for separate shielding installation steps, maintaining manufacturing simplicity while achieving effective electromagnetic interference protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible hybrid interconnect circuits effectively transmit both high-frequency signals and electrical power in a single circuit, reducing weight and size while enhancing thermal dissipation and electromagnetic shielding, enabling conformal attachment to various surfaces.
Implementation Method 1
Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line
Implementation Method 2
All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers
Implementation Method 3
A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as an HF signal line.
Data Source
AI summary
Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.