Hybrid Soft-Rigid Interconnection for Implantable Devices
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Solution Overview
Problem
Current electrical interconnection systems for implantable devices face challenges in reliably connecting soft electronic substrates to external hardware due to mechanical mismatch and bulkiness, leading to alignment issues, stress redistribution, and scaling limitations.
Innovation Solution
A hybrid electrical interconnection system comprising an intrinsically non-elastic interconnection board with conductive tracks and a stretchable interconnect featuring wells or grooves filled with an electrically conductive paste, allowing seamless connection and reducing bulkiness by embedding conductive tracks within the stretchable substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection techniques (surface mount rigid connectors, wire bonding, silicon packaging) are used to connect soft substrates to external hardware, then reliable electrical connection is achieved, but the device becomes stiff and incompatible with soft material mechanics
Solution Approach 1:
The patent uses a soft, flexible encapsulation layer that conforms to the soft substrate surface, replacing rigid connectors and packaging. This flexible encapsulation maintains mechanical compatibility while providing reliable electrical connections through conductive traces integrated into the soft material structure.
Solution Approach 2:
The invention employs composite materials combining soft elastomeric substrates with conductive elements and encapsulation layers. This composite structure integrates electrical connectivity functions within the soft material matrix, achieving both reliability and mechanical adaptability simultaneously.
2Reliability
If individual wire connections are made to each channel on the substrate, then electrical connectivity is established, but the wiring process becomes labour intensive and scaling to larger numbers of channels is limited
Solution Approach 1:
The patent merges multiple individual wire connections into a single integrated flexible printed circuit board structure. This consolidation allows simultaneous connection to multiple channels through a unified component, dramatically improving productivity while maintaining reliable electrical connectivity across all channels.
Solution Approach 2:
The flexible printed circuit board serves multiple functions simultaneously: it provides electrical connectivity to numerous channels, maintains mechanical flexibility, and enables scalable integration. This multi-functional design eliminates the need for separate wiring processes for each channel.
3Reliability
If through holes filled with conductive material are used to join external conductors to the interconnection system, then electrical connection is achieved, but the bulkiness of the system increases and stress redistribution upon elongation is problematic
Solution Approach 1:
The patent extracts the conductive connection function from bulky through-hole structures and integrates it directly into the planar surface of the flexible substrate. Conductive traces are deposited directly on the substrate surface, eliminating the need for voluminous through-holes and reducing overall system bulkiness while maintaining reliable electrical connection.
4Reliability
If accurate alignment is performed during manufacturing to assemble electrical channels, then proper electrical interconnection is achieved, but manufacturing complexity increases and quality issues may arise
Solution Approach 1:
The patent incorporates alignment features and registration marks directly into the flexible substrate design before the assembly process. These pre-integrated alignment elements guide the positioning of external conductors and components, enabling accurate electrical interconnection while simplifying the manufacturing process and reducing quality issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a scalable, reliable, and low-profile interconnection system that minimizes mechanical mismatch and stress redistribution, enabling efficient electrical connectivity while maintaining device flexibility and reducing the risk of failure.
Implementation Method 1
at least one bolus of an electrically conductive paste located within said at least one well or groove, configured to electrically connect said at least one conductive element with said at least one conductive track
Data Source
AI summary
It is disclosed an electrical interconnection system comprising: i) an interconnection board comprising an intrinsically non elastic substrate, said substrate having a first face and an opposed second face, and at least one conductive track on and/or within at least a portion of said substrate; ii) a stretchable interconnect comprising an intrinsically elastic substrate, said substrate comprising at least one well or groove comprising at least one compliant conductive element therein, said at least one well or groove being configured to accommodate said at least one conductive track of said interconnection board; and iii) at least one bolus of an electrically conductive paste located within said at least one well or groove, configured to electrically connect said at least one compliant conductive element with said at least one conductive track.