Hybrid Keyboard with Variable Key Travel for Heat Pipe Integration
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Solution Overview
Problem
Thin profile electronic devices face thermal challenges due to increased performance and function, as traditional cooling systems struggle to accommodate thicker heat pipes and maintain user-friendly key travel in hybrid keyboard designs.
Innovation Solution
A hybrid keyboard design that incorporates thicker heat pipes under lesser-used keys with reduced key travel, allowing for improved thermal performance without compromising the reliability of mechanical keys, by increasing the Z-stack height in specific regions to accommodate additional cooling components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thicker heat pipes are used to improve thermal performance, then cooling efficiency is improved, but the device thickness increases and mechanical key reliability deteriorates due to stress on silicone domes
Solution Approach 1:
The patent applies local quality by creating different key travel heights in different keyboard regions. Specifically, keys positioned over thicker heat pipes (typically in the lower right area where CPU cooling is needed) have reduced key travel, while other keys maintain standard key travel. This localized modification allows thicker heat pipes to be installed without compromising overall keyboard functionality, as the reduced key travel only affects specific keys and not the entire keyboard.
Solution Approach 2:
The patent resolves the contradiction by transitioning from a uniform two-dimensional keyboard layout to a three-dimensional structure with variable key travel depths. By creating a raised support plate or varying the distance between the key switch and the heat pipe, the design accommodates thicker heat pipes in specific regions while maintaining adequate key travel in other regions, effectively using the Z-dimension (vertical space) to resolve the conflict between thermal management and mechanical key reliability.
2Temperature
If thicker heat pipes are installed to enhance cooling, then thermal management is improved, but key travel distance is reduced and user experience deteriorates
Solution Approach 1:
The patent implements local quality by ensuring that only specific keys (those positioned over thicker heat pipes) have reduced key travel, while the majority of keys maintain their standard key travel distance. This selective approach preserves user experience for most keyboard operations while accommodating thermal management requirements in specific localized areas.
Solution Approach 2:
The keyboard is segmented into different functional zones: regions with standard key travel for general typing and regions with reduced key travel over thicker heat pipes. This segmentation allows the system to optimize for both user experience and thermal performance in different areas, rather than compromising the entire keyboard uniformly.
3Ease of operation
If uniform key travel is maintained across all keys, then user experience is preserved, but thicker heat pipes cannot be accommodated in thin profile devices
Solution Approach 1:
The patent resolves this contradiction by applying local quality - maintaining uniform key travel for the majority of keys while creating localized exceptions in specific regions where thicker heat pipes are installed. The raised support plate or variable spacing mechanism ensures that keys over thin heat pipes maintain standard travel, while keys over thick heat pipes have appropriately reduced travel, making the non-uniformity imperceptible to most users.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal performance while maintaining user experience by accommodating thicker heat pipes without undue stress on silicone domes, enabling efficient cooling in thin chassis devices.
Implementation Method 1
one or more heat pipes over a heatsink and along the function and number keys (top key row)
Data Source
AI summary
Particular embodiments described herein provide for an electronic device that includes a hybrid keyboard. The keyboard can include a first portion of keys with a first key travel and a second portion of keys with a second key travel. The second key travel is less than the first key travel and a support plate can be raised under the second portion of keys and cause the second portion of keys to have the second key travel. In an example, a heat pipe or some other component can be located under the raised support plate and second portion of keys with the second key travel.