Hybrid Liquid-Air Cooling Module for High-Density Server Heat Dissipation
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Solution Overview
Problem
Current thermal management solutions for high-density computing environments, particularly mid to high-range servers, struggle to effectively dissipate heat generated by numerous electronic components, leading to potential mechanical and electronic failures, weight issues from heavy cooling components, and increased costs for air conditioning.
Innovation Solution
A hybrid liquid-air cooled module is introduced, comprising a closed loop liquid cooling assembly with a heat exchanger, liquid pump, and cold plate in thermal communication, integrated with an air cooled assembly on an auxiliary drawer, allowing for efficient heat transfer and airflow, and optionally extending server rack width from 19 to 24 inches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to handle high heat dissipation, then heat dissipation capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines liquid cooling and air cooling systems into a single hybrid cooling module. The liquid cooling assembly includes a cold plate with heat exchangers that transfer heat to air via finned heat exchanger surfaces. This merging allows the system to achieve high heat dissipation capabilities through liquid cooling while avoiding the full complexity and cost of dedicated liquid cooling infrastructure by using air as the final heat sink medium.
Solution Approach 2:
The patent introduces a heat exchanger as an intermediary component between the liquid cooling system and the air cooling system. The heat exchanger transfers thermal energy from the liquid-cooled components to the air-cooled fins, enabling efficient heat dissipation without requiring direct liquid contact with all components. This intermediary approach simplifies the overall system architecture while maintaining high heat dissipation performance.
2Temperature
If heavy fans and blowers are used for cooling, then heat dissipation is improved, but weight increases affecting structural rigidity
Solution Approach 1:
The patent employs a finned heat exchanger design that utilizes natural convection and phase change dynamics to transfer heat. The finned structure increases surface area for heat transfer, allowing more efficient heat dissipation without requiring high-velocity air movement. This hydraulic/pneumatic approach replaces heavy mechanical fans with a passive or low-power heat transfer mechanism, reducing weight while maintaining cooling effectiveness.
3Temperature
If vapor chamber spreader is used for heat management, then heat distribution is improved, but extendability to newer CMOS technology is limited
Solution Approach 1:
The patent employs a modular cooling architecture where the cold plate with integrated heat exchangers can be dynamically configured to match different processor heat generation patterns. The system can adapt to varying thermal loads and component layouts through adjustable cooling zones and variable heat exchanger configurations, providing extendability to newer CMOS technologies without being constrained by fixed vapor chamber designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid cooling module enhances thermal management, enabling higher heat dissipation without compromising structural integrity or requiring additional infrastructure, supporting next-generation microprocessors and extending server rack compatibility.
Implementation Method 1
a cold plate in thermal communication with one another
Implementation Method 2
a heat exchanger, a liquid pump and a cold plate in thermal communication with one another
Implementation Method 3
a closed loop liquid cooled assembly includes a heat exchanger, a liquid pump
Data Source
AI summary
A method and incorporated hybrid air and liquid cooled module for cooling electronic components of a computing system is disclosed. The module is used for cooling electronic components and comprise a closed loop liquid cooled assembly in thermal communication with an air cooled assembly, such that the air cooled assembly is at least partially included in the liquid cooled assembly.