Hybrid Logic Interconnects for Bypassable Hard-Soft Signal Paths

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Solution Overview

Problem

Hybrid devices that combine hard logic and soft logic elements are limited in flexibility and functionality, as hard logic blocks often operate in serial fashion and cannot be bypassed or augmented by soft logic, leading to a trade-off between speed, power efficiency, and customization.

Innovation Solution

Configurable interconnects are introduced between hard logic and soft logic elements, allowing signals to be routed between inputs and outputs, enabling hard logic blocks to be bypassed or augmented by soft logic, and allowing soft logic to provide additional signals to hard logic blocks for combined processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If hard logic blocks are used for standard functional blocks, then speed and power efficiency are improved, but flexibility and customization capability deteriorate

Engineering Contradiction:
Improvepower efficiencyVSAvoidflexibility
Core Design Contradiction:
Use of energy by moving objectVSAdaptability or versatility

Solution Approach 1:

The patent combines hard logic blocks and soft logic modules into a single hybrid device, allowing the system to leverage both the power efficiency of hard logic and the flexibility of soft logic. The interconnect fabric merges these two previously separate logic types into an integrated architecture where they can work together.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces configurable interconnects that can dynamically route signals between hard logic blocks and soft logic modules based on operational requirements. This dynamic routing capability allows the system to adapt its architecture at runtime, switching between hard logic and soft logic paths as needed.

Inventive Principle:
Principle #15Dynamics

2Device complexity

If hard logic blocks operate in serial fashion, then device complexity is reduced, but productivity and processing throughput deteriorate

Engineering Contradiction:
ImprovecomplexityVSAvoidthroughput
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent transitions from purely serial hard logic block operation to a multi-dimensional architecture by introducing parallel soft logic modules that can process data simultaneously. The interconnect fabric enables data to flow through multiple paths in parallel, increasing throughput without significantly increasing overall system complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If hard logic blocks operate in isolation, then reliability is improved, but adaptability and functionality deteriorate

Engineering Contradiction:
ImprovereliabilityVSAvoidfunctionality
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent introduces an interconnect fabric as an intermediary between hard logic blocks and soft logic modules. This intermediary enables controlled interaction and signal routing between previously isolated components, allowing functionality to be augmented while maintaining the reliability of individual blocks through controlled interfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Adaptability or versatility

If soft logic is used for customized functionality, then adaptability is improved, but speed and power efficiency deteriorate

Engineering Contradiction:
Improvecustomization capabilityVSAvoidprocessing speed
Core Design Contradiction:
Adaptability or versatilityVSSpeed

Solution Approach 1:

The patent applies local quality by allowing specific portions of the system to use soft logic for customization while other portions continue to use hard logic for high-speed processing. The interconnect fabric enables selective routing, so that only the portions requiring customization use soft logic, while time-critical paths continue to use fast hard logic.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS9000802B2Systems and methods for interfacing between hard logic and soft logic in a hybrid integrated device
Publication Date: 2015.04.07 ALTERA CORP
  • US9000802B2 patent drawing
  • US9000802B2 patent drawing
  • US9000802B2 patent drawing

AI summary

Systems and methods are disclosed for interfacing between hard logic elements and soft logic elements implemented on an integrated device. In particular, a configurable interface is provided that includes interconnects between hard logic and soft logic, which enable signals to be selectively routed between the inputs and outputs of hard logic blocks and soft logic modules. The interconnects allow for certain hard logic blocks to be bypassed in favor of soft logic functionality. Moreover, the interconnects allow soft logic to augment the processing of hard logic blocks, e.g., by providing additional signals to the hard logic block.