Hybrid Material Composition for Additive Manufacturing Shrinkage Reduction
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Solution Overview
Problem
Existing additive manufacturing materials are prone to brittleness, cracking, and shrinkage issues due to thermal and shrinkage-related stress, especially when filled with thermally conductive particles, leading to poor dimensional stability and structural integrity in large structures.
Innovation Solution
A hybrid material composition incorporating an organofunctional silane-based component with a ceramic-forming alkoxide and a reactive diluent, which reduces viscosity and allows solvent removal by evaporation or copolymerization, thereby minimizing shrinkage and enhancing thermal conductivity and elastic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive particles are added to improve thermal conductivity, then thermal conductivity is improved, but the material becomes more brittle and prone to cracking
Solution Approach 1:
The patent uses a composite material system combining organometallic precursors (alkoxides) with organic photopolymer matrices. This composite approach allows the metal particles to provide thermal conductivity while the organic matrix provides flexibility and stress absorption, resolving the contradiction between thermal conductivity and brittleness
Solution Approach 2:
The patent changes the physical state and processing parameters by using sol-gel chemistry with controlled hydrolysis and condensation reactions. By controlling the solvent content and reaction conditions, the material achieves a balance between particle loading for thermal conductivity and matrix flexibility to prevent cracking
2Temperature
If filler content is increased to improve thermal conductivity, then thermal conductivity is improved, but shrinkage and cracking increase
Solution Approach 1:
The patent uses organic solvent as an intermediary during the sol-gel process. The solvent controls the hydrolysis and condensation reactions of alkoxide precursors, enabling gradual network formation that accommodates filler particles without excessive shrinkage or stress concentration that would cause cracking
Solution Approach 2:
The patent controls the solvent content and reaction kinetics parameters to achieve optimal filler loading. By adjusting the water-to-alkoxide ratio and reaction conditions, the material achieves high filler content for thermal conductivity while maintaining dimensional stability and minimizing shrinkage-induced cracking
3Strength
If material is cured by UV crosslinking to achieve hardening, then structural integrity is improved, but shrinkage phenomena and internal stress increase
Solution Approach 1:
The patent modifies the curing parameters by using controlled UV irradiation doses and dual-curing mechanisms (photopolymerization plus sol-gel condensation). This gradual, multi-stage curing approach reduces rapid shrinkage and internal stress while achieving the required structural integrity
Solution Approach 2:
The patent combines two curing mechanisms: photopolymerization of the organic matrix and sol-gel condensation of metal oxide networks. This composite curing approach distributes the shrinkage and stress across different timescales and mechanisms, reducing overall internal stress while maintaining structural integrity
4Ease of manufacture
If organic solvent is present in the material to enable processing, then processability is improved, but shrinkage and cracking increase during solidification
Solution Approach 1:
The patent performs preliminary controlled hydrolysis and condensation reactions during the mixing and printing stages. This preliminary action allows the sol-gel network to form gradually, accommodating solvent removal without sudden shrinkage or stress concentration that would cause cracking during final curing
Solution Approach 2:
The patent utilizes the phase transition of the organic solvent from liquid to vapor during controlled evaporation and curing. By managing this phase transition gradually through controlled heating and ventilation, the solvent is removed without causing rapid shrinkage or capillary pressure that would lead to cracking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid material composition achieves reduced shrinkage by up to 50% and improved thermal conductivity, allowing for higher filler loading without cracking, and better stress distribution during solidification, resulting in more stable and thermally conductive 3D printed structures.
Implementation Method 1
the hybrid material composition comprising a reactive diluent which reduces the viscosity of the uncrosslinked material composition
Implementation Method 2
at least a first material made of an organofunctional silane-based component with a ceramic-forming alkoxide component
Implementation Method 3
as a result of UV crosslinking and/or condensation reactions
Implementation Method 4
a light-curing plastic, for example an acrylic, epoxy and/or vinyl ester resin, is cured by a laser in thin layers
Implementation Method 5
this leads to shrinkage phenomena and states of tension, because the solvent present in the original liquid is at least partially enclosed during solidification
Implementation Method 6
the solvent present in the original liquid is at least partially enclosed during solidification and slowly leaves the solid again through diffusion processes
Implementation Method 7
the solvent present in the original liquid is at least partially enclosed during solidification and slowly leaves the solid again through diffusion processes
Implementation Method 8
Under unfavorable conditions, the capillary pressure that occurs can even lead to the formation of cracks or even bursting
Implementation Method 9
the entire thermal and shrinkage-related stress must be buffered by the surrounding network and poses enormous challenges for the material
Data Source
AI summary
The invention relates to a hybrid material composition for use in additive manufacturing processes, for example in 3D printing, particularly for the production of large structures with a highly filled material that is thermally conductive and temperature-stable, as well as its use in an additive manufacturing process. The presence of at least one reactive diluent in the hybrid material composition enables, in addition to a significant reduction in shrinkage due to crosslinking and thus improved dimensional stability, from approximately 10% to less than 5%, also the influencing of the elastic and rheological properties of the hybrid polymer.