Hybrid Memory Module Thermal Layout for Flash Life
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Solution Overview
Problem
Current memory modules, particularly in servers handling big data, face throughput bottlenecks due to the lower performance of PCI-SSDs compared to DRAMs, and flash memories' shorter service life when exposed to high temperatures, which are not adequately addressed by existing technologies.
Innovation Solution
A memory module design featuring a double-sided substrate with strategically arranged memory controllers, DRAMs, and flash memories, where flash memories are positioned closer to the back surface to minimize heat exposure from CPU heat sources, and heat-dissipating components are optimized to maintain ambient temperatures within a safe range, enhancing packaging density and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If flash memories are densely packed to increase packaging density, then storage capacity is improved, but ambient temperature increases causing shorter service life
Solution Approach 1:
The patent applies local quality by creating distinct thermal zones within the memory module. Flash memories are positioned in regions with better heat dissipation conditions (away from the CPU heat source), while other components are arranged in different thermal zones. This spatial differentiation of thermal environments allows high-density packing while protecting flash memories from excessive heat, thus maintaining both packaging density and service life.
2Area of stationary object
If flash memories are positioned closer to CPU heat sources to reduce space, then packaging density is improved, but temperature increases reducing service life
Solution Approach 1:
The patent resolves the space-temperature contradiction by utilizing the vertical dimension (substrate layers) rather than only horizontal arrangement. Flash memories are mounted on the substrate at positions that are closer to the first edge (socket terminal side) rather than directly under the CPU, and the substrate's multi-layer structure provides thermal management pathways. This three-dimensional spatial arrangement optimizes both space utilization and thermal conditions.
3Speed
If DRAMs are used to provide high throughput, then CPU memory bus throughput is improved, but storage capacity is limited compared to flash memories
Solution Approach 1:
The patent merges different types of memory technologies (DRAM and flash memory) into a single hybrid memory module. DRAMs provide high-speed buffer storage for frequently accessed data, while flash memories provide high-capacity storage for larger datasets. This combination allows the system to achieve both high throughput for critical operations and high storage capacity for overall data handling, resolving the trade-off between speed and capacity.
Data Source
AI summary
A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.