Hybrid MEMS Actuator Integration on CMOS Substrate
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Solution Overview
Problem
Existing methods for producing microelectronic devices, such as MEMS chip devices, face challenges in integrating electrodynamic and piezoelectric actuators effectively, particularly in achieving low resistance and high dynamic range with efficient energy consumption while maintaining cost-effectiveness.
Innovation Solution
A method involving the application of a copper-based electrodynamic actuator and a piezoelectric actuator, preferably made of PZT or KNN materials, to a silicon wafer carrier substrate, with specific annealing and deposition steps, allowing for the integration of both actuators on a CMOS substructure, enabling efficient energy use and large dynamic range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-based electrodynamic actuators are applied to achieve low resistance, then conductivity is improved, but manufacturing complexity increases due to integration challenges with piezoelectric actuators
Solution Approach 1:
The patent combines copper-based electrodynamic actuators and piezoelectric actuators into a single integrated device structure, merging two different actuation mechanisms on the same substrate to achieve both low resistance and complex functionality while managing manufacturing through unified processing steps
Solution Approach 2:
The device employs composite construction by integrating copper conductors with piezoelectric ceramic materials on a common substrate, creating a hybrid actuator system that leverages the electrical conductivity of copper and the piezoelectric properties of the ceramic material
2Adaptability or versatility
If piezoelectric actuators are applied to achieve large dynamic range, then actuator performance is improved, but energy consumption increases
Solution Approach 1:
The patent merges electrodynamic and piezoelectric actuators to create a hybrid system where the electrodynamic component handles low-frequency or static positioning tasks with lower energy consumption, while the piezoelectric component provides high-speed, large-range dynamic adjustments, optimizing overall energy efficiency across different operating conditions
3Reliability
If copper conductors are applied to achieve low resistance, then electrical conductivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary annealing treatment to the copper conductors during the manufacturing process, performing this thermal processing step before final device assembly to reduce residual stresses and improve electrical conductivity while establishing the conductor geometry early in the manufacturing sequence when precision control is more manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective microelectronic device with enhanced conductivity and piezoelectric properties, achieving a large dynamic actuator range with low energy consumption and allowing for hermetic encapsulation of MEMS resonators.
Implementation Method 1
at least one electrodynamic actuator made of a metal conductor formed at least largely of copper is applied to the carrier substrate
Implementation Method 2
at least one piezoelectric actuator is applied to the carrier substrate in at least one further method step
Implementation Method 3
in at least one annealing step, which is in particular different from the at least one method step and the at least one further method step, the at least one electrodynamic actuator is annealed on the carrier substrate, in particular on the CMOS substructure, at at least 400° C., preferably at at least 450° C., particularly preferably at at least 500° C.
Data Source
AI summary
A method for producing a microelectronic device, in particular a MEMS chip device, comprising at least one carrier substrate. At least one electrodynamic actuator made of a metal conductor formed at least largely of copper is applied to the carrier substrate in at least one method step. At least one piezoelectric actuator is applied to the carrier substrate in at least one further method step.