Hybrid Millimeter-Wave Antenna Layout for Multi-Band Thin Devices
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Solution Overview
Problem
Designing mobile devices to support multiple millimeter-wave bands is costly and results in increased thickness due to the need for separate antennas, which is undesirable for users.
Innovation Solution
A hybrid antenna solution that combines on-chip and board-based antenna arrays, using coupled annular ring and rectangular patches to support multiple bands with a single feed trace per polarization, allowing for a compact and thinned design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate antennas are used for each millimeter-wave band, then each band can be supported independently, but device thickness increases and manufacturing cost increases
Solution Approach 1:
The patent combines multiple antenna elements for different millimeter-wave bands into a single integrated antenna structure. The antenna includes multiple radiating elements that can operate across 24-29.5 GHz, 37-43.5 GHz, and 57-70 GHz bands simultaneously, eliminating the need for separate antennas for each band and thereby reducing device thickness.
Solution Approach 2:
The antenna structure is designed to perform multiple functions by supporting operation across three different millimeter-wave bands. The radiating elements and feeding networks are configured to enable the same antenna structure to transmit and receive signals in multiple frequency ranges, making it universally applicable for multi-band mobile devices.
2Adaptability or versatility
If separate antennas are used for each millimeter-wave band, then each band can be supported independently, but manufacturing cost increases
Solution Approach 1:
The patent integrates multiple antenna elements and feeding networks into a single manufactured component. By combining the antenna structures for different bands into one unit, the manufacturing process is simplified, requiring fewer assembly steps and reducing overall production costs compared to manufacturing and assembling separate antennas for each band.
Solution Approach 2:
The antenna design achieves multi-band functionality through a universal structure that can be manufactured using standard PCB fabrication processes. The integrated design allows for single-step manufacturing of the entire multi-band antenna system, reducing complexity and cost compared to producing multiple separate antenna components.
3Adaptability or versatility
If multiple antenna elements are integrated, then multi-band support is achieved, but board routing complexity increases
Solution Approach 1:
The patent divides the antenna structure into distinct radiating elements and feeding network segments that are systematically arranged on the PCB. Each band has dedicated radiating elements connected through organized feeding traces, which simplifies the routing design by creating modular, repeatable patterns rather than complex interwoven connections.
Solution Approach 2:
The patent utilizes multiple PCB layers to route feeding networks and connect radiating elements. By moving routing connections to different vertical layers rather than confining all traces to a single plane, the design reduces trace interference and simplifies the overall board routing complexity while maintaining multi-band functionality.
Data Source
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AI summary
Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.