Hybrid Module Resilient Pin Connection for Shielded RF Packaging
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Solution Overview
Problem
Existing microwave frequency applications face challenges in providing cost-effective electrical connections between components while ensuring radiation shielding and compactness, often requiring expensive manufacturing techniques like feedthrough filters, brazing, and welding.
Innovation Solution
A hybrid module design featuring a microwave frequency circuit submodule and a low frequency circuit submodule connected via a resilient pin, housed within conductive housing parts, which eliminates the need for expensive connections and allows for direct electrical contact and shielding, using a conductive layer on the low frequency circuit substrate for additional radiation protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If expensive manufacturing techniques like feedthrough filters, brazing, and welding are used to connect submodules, then connection reliability and radiation shielding are improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent extracts and eliminates the expensive feedthrough filter component from the traditional design. Instead of using a feedthrough filter that requires brazing and welding, the invention uses a simple resilient pin that directly contacts the circuit board, removing the complex filtering component while maintaining electrical connection functionality through the conductive housing parts.
Solution Approach 2:
The resilient pin serves as an intermediary element between the first and second conductive housing parts. It provides the electrical connection and mechanical coupling between submodules without requiring direct welding or brazing of the housing parts themselves, simplifying the manufacturing process while maintaining connection reliability.
2Object-affected harmful factors
If traditional connection methods with feedthrough filters are used, then radiation shielding is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the electrical connection function and the radiation shielding function into the conductive housing parts. The first and second conductive housing parts serve dual purposes: providing mechanical support and electrical connection through the resilient pin, while simultaneously acting as radiation shields. This eliminates the need for separate feedthrough filter components that would otherwise be required for shielding.
Solution Approach 2:
The conductive housing parts are designed to perform multiple functions: structural support, electrical connection conduit, and radiation shielding. This multi-functionality replaces the traditional multi-component assembly of feedthrough filters, mounting brackets, and separate shielding elements, significantly reducing manufacturing complexity.
3Reliability
If submodules are connected using conventional methods, then electrical connection is provided, but compactness and frequency response are compromised
Solution Approach 1:
The resilient pin introduces a dynamic element to the connection system. Its spring-like properties allow it to flex and adapt to manufacturing tolerances and thermal expansion, maintaining reliable electrical contact without requiring precise rigid positioning. This enables a more compact design where submodules can be placed closer together while still ensuring consistent electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-cost, compact, and efficient electrical connection that reduces manufacturing complexity and interference, while enhancing frequency response and reducing losses, and allows for easy compensation of manufacturing tolerances.
Implementation Method 1
a resilient pin mounted to the low frequency circuit submodule, wherein the resilient pin is adapted to releasably contact the microwave frequency circuit submodule in order to provide, between the submodules, a connection, so that via the connection the low frequency circuit submodule can supply the microwave frequency circuit submodule with the electrical signal
Implementation Method 2
a first conductive housing part that houses at least part of the low frequency circuit submodule; a second conductive housing part that houses at least part of the microwave frequency circuit submodule
Data Source
AI summary
A hybrid module includes a microwave frequency circuit submodule configured for processing microwaves having a high frequency and a low frequency circuit submodule. The low frequency circuit submodule is opposite to the microwave frequency circuit submodule and supplies the microwave frequency circuit submodule with an electrical signal having a low frequency. The high frequency is at least two times higher than the low frequency. The hybrid module includes a first conductive housing part that houses at least part of the low frequency circuit submodule, and a second conductive housing part that houses at least part of the microwave frequency circuit submodule. A resilient pin is mounted to the low frequency circuit submodule. The resilient pin releasably contacts the microwave frequency circuit submodule to provides, between the submodules, a connection, so that via the connection the low frequency circuit submodule can supply the microwave frequency circuit submodule with the electrical signal.