Hybrid Moisture Barrier Layer for OLED Encapsulation
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Solution Overview
Problem
Organic electronic devices such as OLEDs and organic solar cells are vulnerable to moisture and oxygen, requiring effective encapsulation to increase their lifetime, but existing methods face challenges in providing a reliable moisture barrier while maintaining productivity and cost-effectiveness.
Innovation Solution
A hybrid moisture barrier layer is manufactured by combining a photocurable or heat-curable solution layer with an ALD-derived layer, using materials like aluminum oxide and IGZO, and incorporating a planarization layer to enhance bonding and prevent moisture penetration, thereby improving the reliability and efficiency of the moisture barrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single moisture barrier layer is formed using conventional methods, then the manufacturing process is simple, but the moisture barrier reliability is insufficient
Solution Approach 1:
The patent employs a hybrid moisture barrier layer combining organic material (photocurable or heat-curable composition) and inorganic material (ALD-formed layer such as aluminum oxide, zinc oxide, or indium gallium zinc oxide). This composite structure leverages the advantages of both materials: the organic layer provides flexibility and coverage, while the inorganic layer delivers superior moisture barrier properties, achieving enhanced reliability without excessive complexity
Solution Approach 2:
The moisture barrier function is divided into two distinct layers: a first moisture barrier layer formed by photocuring or heat curing of a liquid solution, and a second moisture barrier layer formed by atomic layer deposition. This segmentation allows each layer to perform its specialized function optimally, with the organic layer providing base protection and the inorganic layer providing enhanced moisture blocking
2Reliability
If atomic layer deposition is used to form the moisture barrier layer, then the moisture barrier effect is enhanced, but the productivity decreases due to long processing time
Solution Approach 1:
The patent merges two different deposition methods into a hybrid structure where the organic layer is formed by photocuring or heat curing (faster process) and the inorganic layer is formed by atomic layer deposition (superior barrier). By combining these methods rather than using ALD alone, the patent achieves high moisture barrier effectiveness while reducing overall processing time and improving productivity
Solution Approach 2:
The ALD process is applied partially rather than forming the entire moisture barrier layer through ALD. The inorganic layer thickness is optimized to provide sufficient barrier enhancement without requiring complete ALD processing, thereby reducing manufacturing time while maintaining effective moisture protection
3Reliability
If the moisture barrier layer is formed directly on the base film, then the manufacturing process is simple, but the bonding reliability is insufficient
Solution Approach 1:
The patent introduces a planarization layer formed before the moisture barrier layer on the base film. This preliminary action creates a smooth, planar surface that enhances the bonding between the base film and the moisture barrier layer, preventing defects and improving adhesion reliability without significantly complicating the overall process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid moisture barrier layer effectively reduces moisture and foreign substance penetration, increases productivity, and enhances the reliability of the moisture barrier effect, achieving a water vapor transmission rate suitable for various device modules.
Implementation Method 1
applying a photocurable or heat-curable solution material on the base film and then performing photocuring or heat curing
Implementation Method 2
applying a photocurable or heat-curable solution material on the base film and then performing photocuring or heat curing
Implementation Method 3
laminating at least one second moisture barrier layer having a thickness corresponding to 1/2 to 1/3 of the total thickness of the first moisture barrier layer by performing atomic layer deposition (ALD) on the base film
Data Source
AI summary
This application relates to a method for manufacturing a hybrid moisture barrier layer. In one aspect, the method includes preparing a base film and applying a photo-curable or heat-curable solution material to the base film, followed by photocuring or thermal curing to deposit at least one first moisture barrier layer. The method also includes depositing at least one second moisture barrier layer on the base film through atomic layer deposition (ALD), the second moisture layer being ⅓ to ½ the total thickness of the first moisture barrier. According to various embodiments, a combination of a moisture barrier layer formed by applying the photo-curable or heat-curable solution and a moisture barrier layer formed by atomic layer deposition at an effective thickness ratio brings about an effective reduction in production lead time as well as an improvement in the reliability of moisture barrier effect.