Hybrid Mold Chase Surface for Mold Bleed and ESD Control

Solution Overview

Problem

Semiconductor substrates are susceptible to electrostatic discharge (ESD) events during ejection from mold chases, leading to damage such as cracking or chipping, due to adhesion between the substrates and mold clamp surfaces.

Innovation Solution

The implementation of a mold chase with a hybrid surface texture, featuring alternating regions of smooth and rough surfaces, where the smooth surface prevents mold bleed and the rough surface reduces ESD events by minimizing electrostatic bonding during ejection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the mold chase surface is made smooth, then mold bleed is prevented, but electrostatic discharge events increase during ejection

Engineering Contradiction:

Improvemold bleed preventionVSAvoidelectrostatic discharge events

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The mold chase surface is divided into different regions with different surface qualities: a first region with a smooth surface texture to prevent mold bleed, and a second region with a rough surface texture to reduce electrostatic discharge events during ejection. This local differentiation allows each region to optimize for its specific function.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the mold chase surface is made rough, then electrostatic discharge events are reduced, but mold bleed occurs

Engineering Contradiction:

Improveelectrostatic discharge eventsVSAvoidmold bleed prevention

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The mold chase surface is divided into different regions with different surface qualities: a first region with a smooth surface texture to prevent mold bleed, and a second region with a rough surface texture to reduce electrostatic discharge events during ejection. This local differentiation allows each region to optimize for its specific function.

Inventive Principle:

Principle #3Local quality

3Strength

If adhesion between substrate and mold clamp is increased, then bonding strength is improved, but damage during ejection increases

Engineering Contradiction:

Improvebonding strengthVSAvoidcracking or chipping damage

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The mold chase surface is divided into different regions with different surface qualities: a first region with a smooth surface texture to prevent mold bleed, and a second region with a rough surface texture to reduce electrostatic discharge events during ejection. This local differentiation allows each region to optimize for its specific function.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hybrid surface texture effectively reduces the frequency and severity of ESD events, protecting the semiconductor substrates and maintaining their integrity by minimizing electrostatic bonding while preventing mold bleed issues.

Implementation Method 1

Semiconductor substrates are susceptible to electrostatic discharge (ESD) events during ejection from mold chases, leading to damage such as cracking or chipping, due to adhesion between the substrates and mold clamp surfaces

Methodology Applied

Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS12191164B2Hybrid mold chase surface for semiconductor bonding and related systems and methods

Publication Date: 2025.01.07 MICRON TECHNOLOGY INC

AI summary

Mold chases for molding semiconductor devices and/or components of semiconductor devices, the resulting semiconductor devices and/or their components, and related systems and methods are disclosed herein. In some embodiments, the mold chase includes a first clamp and a second clamp having a substrate engaging surface oriented towards the first clamp. The substrate engaging surface can have a hybrid surface texture that includes a first region and a second region at adjacent the first region (on a lateral side of the first region). The first region can include a first surface texture that is relatively smooth. The second region can include a second surface texture that is relatively rough compared to the first surface texture. The first surface texture can prevent mold bleed during a molding process. The second surface texture can reduce electrostatic discharge events during an ejection from the mold chase.