Hybrid Molding with Selective Release Ink for Molded Interconnected Devices
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Solution Overview
Problem
Conventional additive manufacturing processes require post-processing of molded articles to integrate features like circuit traces, which can compromise the integrity of the finished product due to exposure to chemicals and heat, and do not allow for direct integration of features during the molding process.
Innovation Solution
A direct-write additive manufacturing method where a surface treatment is applied to a mold, followed by deposition of an ink with functionalized particles or fibers that adhere stronger to the molded article than the mold, allowing for 'release on demand' and integration of features during the molding process, eliminating the need for post-processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If post-processing is used to integrate features like circuit traces onto molded articles, then features can be added to the article, but the integrity of the finished product is compromised due to exposure to chemicals and heat
Solution Approach 1:
The patent applies preliminary action by depositing the functional material (e.g., circuit trace material) onto the mold surface before the molding process begins. This allows the feature to be integrated into the article during molding, eliminating the need for post-processing that would expose the finished product to damaging chemicals and heat.
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: (1) depositing functional material on the mold surface, (2) molding the article around the deposited material, and (3) releasing the finished article with integrated features. This segmentation allows the functional material to be protected during molding while still achieving integration.
2Adaptability or versatility
If conventional additive manufacturing is applied after molding, then features can be added to articles, but it requires separate post-processing steps that increase manufacturing time and complexity
Solution Approach 1:
The patent merges the additive manufacturing step with the molding process by depositing functional material onto the mold surface before molding. This combination eliminates separate post-processing steps, thereby increasing manufacturing efficiency while maintaining the ability to add complex features like circuit traces.
Solution Approach 2:
By performing the additive manufacturing step preliminarily (before molding), the patent eliminates the need for separate post-processing operations, thereby improving productivity without sacrificing feature integration capability.
3Adaptability or versatility
If material is deposited on the mold surface, then features can be integrated into the molded article, but the material may adhere to the mold instead of releasing with the article
Solution Approach 1:
The patent applies parameter changes by carefully controlling the surface energy characteristics of both the mold and the deposited material. By adjusting these parameters, the material adheres strongly during molding but releases easily after molding, solving the adhesion-release contradiction.
Solution Approach 2:
The patent uses the mold surface as an intermediary that temporarily holds the functional material during molding. The surface energy of the mold is engineered to allow easy release after molding, enabling the material to transfer to the article while facilitating subsequent demolding.
4Strength
If the ink material bonds strongly to the polymer, then the printed structure releases from the mold with the article, but the bond strength must exceed the polymer/mold adhesion interface
Solution Approach 1:
The patent applies parameter changes by precisely controlling the surface energy parameters of the mold, ink material, and polymer. This allows the ink/polymer bond strength to be optimized to exceed the polymer/mold adhesion interface, ensuring reliable release with the article while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances multi-material adhesion, surface finish, and long-term stability, enabling the creation of hybrid structures with improved mechanical and electrical properties without the need for post-processing, particularly beneficial for Molded Interconnected Devices (MIDs).
Implementation Method 1
a functionalization agent surrounding particles in the fluid ink are selected to allow the fluidized particles to adhere to the mold before injection and the molded article, rather than the mold, after molding
Implementation Method 2
The deposited ink is cured to evaporate a solvent carrier
Implementation Method 3
sintered to bond or melt the particles or fibers to each other within the trace
Data Source
AI summary
A method for additive manufacturing using releasable inks on a substrate mold includes applying a surface treatment to a surface of a mold defining an article for manufacturing, and depositing an ink including particles or fibers of a trace material onto the surface treatment. The particles are coated with a functionalization agent based on a surface energy of the surface treatment for providing a release on demand of the printed trace. The deposited ink is cured to evaporate a solvent carrier, and sintered to bond or melt the particles or fiber together r. The article is molded by adding a molding substance to the mold over the trace, and releasing the molded article from the mold, such that the trace adheres to either the mold or the article based on the functionalization agent providing the trace greater adhesion to the mold or the article to effect the release on demand.