Hybrid Multi-Wavelength Source With Laser Array And Planar Lightwave Circuit
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Solution Overview
Problem
Existing optical data communication systems face challenges in achieving reliable and efficient laser light sources with minimal form factor, optimal expense, and reduced energy consumption.
Innovation Solution
A hybrid multi-wavelength source (MWS) is developed, integrating a laser array chip and a planar lightwave circuit (PLC) with an optical fiber alignment device on a substrate, utilizing flip-chip bonding and optical index-matched epoxy for alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional separate laser sources are used for each wavelength, then wavelength coverage is achieved, but device complexity and form factor increase
Solution Approach 1:
The patent combines multiple laser diodes with different wavelengths into a single integrated laser array chip. The chip includes multiple laser diodes arranged in an array, each emitting at a different wavelength, which are collectively coupled to a single PLC. This merging approach achieves multi-wavelength coverage while reducing device complexity compared to using separate laser sources for each wavelength.
Solution Approach 2:
The laser array chip serves as a universal source that can provide multiple wavelengths simultaneously. By integrating multiple laser diodes into a single chip structure with a common mounting surface and collective coupling mechanism, the system achieves multi-functionality where one component performs the role of multiple separate laser sources.
2Adaptability or versatility
If multiple separate laser sources are integrated with PLC, then multi-wavelength output is achieved, but alignment precision and optical losses worsen
Solution Approach 1:
The patent merges the coupling interface by providing a single collective coupling region on the PLC where all laser diodes from the array are coupled simultaneously. This unified coupling approach eliminates the need for multiple separate alignment interfaces, thereby improving alignment precision and reducing optical losses associated with multiple discrete coupling points.
3Ease of manufacture
If conventional bonding methods are used for mounting laser diodes, then assembly is simplified, but alignment precision and optical coupling efficiency deteriorate
Solution Approach 1:
The patent implements preliminary action by providing pre-formed optical coupling structures on both the laser array chip and the PLC before final assembly. The laser array chip includes a collective coupling region with pre-defined optical interfaces, and the PLC includes corresponding pre-formed coupling structures. This preliminary preparation enables precise alignment and efficient optical coupling while maintaining assembly simplicity, as the critical alignment features are already in place before the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid MWS efficiently supplies multiple wavelengths of continuous wave laser light, reducing optical losses and enhancing alignment precision, thereby improving the reliability and efficiency of optical data communication systems.
Implementation Method 1
a first optical amplifier including a first doped fiber and a first pump source, the first optical amplifier configured to amplify the first optical signal at a first wavelength
Implementation Method 2
a second optical amplifier including a second doped fiber and a second pump source, the second optical amplifier configured to amplify the second optical signal at a second wavelength
Implementation Method 3
an optical combiner configured to combine the first optical signal and the second optical signal into a single composite optical signal
Data Source
Figure 1A~1B
Figure 1C
Figure 1D~1E
AI summary
A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.