Hybrid-Bonded Optical Package Structure for Precise Coupling
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Solution Overview
Problem
Existing package structures and fabrication methods for semiconductor devices are inadequate in integrating diverse functionalities and suffer from inefficiencies in optical coupling and light loss, leading to suboptimal performance and reliability.
Innovation Solution
A package structure is developed that includes a composite die with an optical package structure and an electronic die, where the optical die is adjacent to the composite die, utilizing hybrid bonding and shared top interposers to enhance alignment accuracy and reduce light loss, thereby improving optical coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate packaging methods are used for optical and electronic devices, then manufacturing flexibility is maintained, but integration of diverse functionalities and alignment accuracy deteriorate
Solution Approach 1:
The patent merges optical and electronic devices into a single composite die structure, where both device types are integrated on the same substrate. This combining approach enables diverse functionalities to be achieved while maintaining precise alignment through shared fabrication processes and common reference structures, thereby resolving the contradiction between integration capability and alignment precision.
Solution Approach 2:
The composite die is designed with universal characteristics that accommodate both optical and electronic functionalities. The structure includes multiple device regions and interconnection systems that can handle different signal types (optical and electrical), providing multi-functionality while maintaining a unified manufacturing process that ensures consistent alignment across all device types.
2Ease of manufacture
If conventional packaging structures are used, then manufacturing simplicity is maintained, but optical coupling efficiency deteriorates due to light loss
Solution Approach 1:
The patent introduces an intermediary optical coupling structure that bridges the optical devices and waveguides. This intermediate layer includes optical coupling elements and alignment features that facilitate efficient light transfer while maintaining compatibility with conventional manufacturing processes. The intermediary structure reduces light loss through optimized optical paths without requiring complete redesign of the manufacturing system.
3Adaptability or versatility
If larger package structures are used to accommodate multiple devices, then device integration is improved, but form factor increases
Solution Approach 1:
The patent implements a nested arrangement where optical and electronic devices are positioned in a compact, space-efficient configuration on the composite die. Devices are arranged to utilize three-dimensional space effectively, with some components positioned in layers or stacked configurations. This nesting approach maximizes device integration density while minimizing the overall package footprint, thereby reducing the form factor.
4Manufacturing precision
If hybrid bonding is not used, then manufacturing complexity is reduced, but alignment accuracy and optical coupling efficiency deteriorate
Solution Approach 1:
The patent incorporates preliminary alignment features and bonding structures during the early stages of composite die fabrication. Alignment marks, reference structures, and bonding interfaces are pre-formed on the substrate before device assembly. This preliminary action ensures that subsequent bonding operations achieve high alignment accuracy without requiring complex real-time adjustment mechanisms, thereby managing manufacturing complexity while maintaining precision.
Data Source
AI summary
A package structure and method for forming the same are provided. The package structure includes a top interposer formed over a substrate, and a first die formed over the top interposer. The first die includes an optical package structure, and the optical package structure includes first optical components. The first die also includes an electronic die bonded to the optical package structure to form a hybrid bonding structure. The hybrid bonding structure includes a metal-to-metal bonding and dielectric-to-dielectric bonding. The package structure includes an optical die adjacent to the first die, and the top interposer is shared by the optical die and the first die.