Hybrid Optical Package With Thinned Interposer Signal Integration
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components efficiently for signal conversion and processing, particularly in devices that require both long-range optical and short-range electrical signal transmission and processing.
Innovation Solution
The development of a photonic integrated circuit (PIC) with a silicon-on-insulator substrate, incorporating optical components such as waveguides, couplers, and modulators, bonded to an electronic integrated circuit (EIC) using dielectric-to-dielectric and metal-to-metal bonding, with a thinned interposer structure for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated in a single package, then signal conversion and processing efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates optical components (photonic die with waveguides, modulators, detectors) and electrical components (electronic die with processors, memory, I/O interfaces) into a single hybrid optical-electronic package. This merging enables direct coupling between optical signal transmission and electrical signal processing, improving overall system efficiency by eliminating the need for separate packaging and interconnections while maintaining functional integration.
2Length of moving object
If optical fiber applications are used for long-range signal transmission, then transmission distance is improved, but integration with short-range electrical components becomes more difficult
Solution Approach 1:
The patent divides the integrated system into distinct functional segments: a photonic die containing optical components (waveguides, modulators, detectors) optimized for long-range transmission, and an electronic die containing electrical components (processors, memory, I/O) optimized for short-range processing. These segmented dies are then integrated through a hybrid package with dedicated interconnect structures, allowing each segment to be optimized independently while achieving seamless long-range optical transmission and short-range electrical processing within a unified system.
Data Source
AI summary
Optical devices and methods of manufacture are presented herein. In an embodiment, an optical device is provided that includes an optical package having a first surface and a second surface opposite the first surface, a laser die package having a third surface and a fourth surface opposite the third surface, wherein the first surface is planar with the third surface and the second surface is planar with the fourth surface, a first silicon support attached to both the second surface and the fourth surface, and an interposer attached to both the first surface and the third surface, wherein the interposer is free of a silicon substrate.