Hybrid Package Lid With Diamond Insert for IC Heat Dissipation
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Solution Overview
Problem
Existing IC packaging techniques face challenges in thermal dissipation, particularly in high-performance chips for machine learning and artificial intelligence, where copper-based lids are insufficient, and alternative materials with higher thermal conductivity are expensive and mechanically less robust.
Innovation Solution
A hybrid material approach using a metal member, such as copper, combined with a high thermal conductivity material like diamond composites, to form a lid, heat sink, or cold plate, enhancing thermal conductivity while maintaining mechanical robustness and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If copper is used for package lid, then mechanical robustness and ease of manufacture are improved, but thermal conductivity is insufficient for high-performance chips
Solution Approach 1:
The patent applies composite materials by combining copper (for mechanical strength) with diamond or diamond-like carbon (for high thermal conductivity) to create a hybrid package lid that achieves both mechanical robustness and superior thermal dissipation performance
2Temperature
If diamond materials are used for package lid, then thermal conductivity is improved, but manufacturing cost and fabrication difficulty increase
Solution Approach 1:
The patent uses composite materials where diamond or diamond-like carbon is integrated with copper, achieving high thermal conductivity while maintaining ease of manufacture through established copper fabrication processes
Solution Approach 2:
The patent changes the material parameter from pure copper to copper-diamond composite, fundamentally altering the thermal conductivity property while maintaining manufacturability through adaptive fabrication processes
3Temperature
If diamond materials are used for package lid, then thermal conductivity is improved, but mechanical robustness decreases
Solution Approach 1:
The patent applies composite materials by combining copper (for mechanical strength) with diamond or diamond-like carbon (for high thermal conductivity) to create a hybrid package lid that achieves both mechanical robustness and superior thermal dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid material design improves thermal conductivity by up to twice that of copper alone, making it easier and less expensive to manufacture than all-diamond components, effectively addressing thermal dissipation challenges in high-performance IC packages.
Implementation Method 1
the lid is traditionally made from a metal such as copper. Copper exhibits relatively good thermal conductivity
Data Source
AI summary
Heat transfer apparatus may include an integrated circuit (“IC”) package that itself includes a package substrate and one or more dies coupled to the package substrate such that bottom surfaces of the dies face toward the package substrate and top surfaces of the dies define die top areas. A metal member, such as a package lid, a heat sink, or a cold plate, may be designed to fit above at least part of the package substrate. A heat transfer member having a higher thermal conductivity than the metal member is attached to the metal member such that the heat transfer member is disposed over a die top area when the metal member is placed over the package substrate. In some embodiments, the heat transfer member may comprise a diamond material.