Hybrid Packaging Material Shrinkage Control via Solvent Substitution
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Solution Overview
Problem
Conventional inorganic nanosols used in electrical, electronic, and energy applications suffer from shrinkage during drying and curing reactions due to solvent content, leading to degraded dimensional stability and reliability, and lack the necessary water and gas barrier properties for passivation and terminal treatments.
Innovation Solution
A method involving surface-treatment of inorganic nanosols with organic metal alkoxides, substitution of organic solvents with functional organic monomers or silicon compounds, and addition of nanoclay to create a solvent-free or solvent-controlled hybrid packaging material that prevents contraction during drying and curing, enhancing mechanical and barrier properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional inorganic nanosol with solvent is used, then wet process capability is improved, but shrinkage during drying and curing occurs leading to degraded dimensional stability
Solution Approach 1:
The patent changes the chemical composition parameters of the nanosol by substituting conventional solvents with solvent-free formulations containing organic monomers and silicon compounds. This parameter change eliminates the shrinkage issue while preserving wet process applicability, as the material can still be applied in liquid form but without the harmful solvent evaporation that causes dimensional instability.
Solution Approach 2:
The patent creates a composite inorganic-organic hybrid material system where inorganic nanosols are combined with organic monomers and silicon compounds. This composite approach allows the material to exhibit both the wet process capabilities of organic components and the dimensional stability of inorganic networks, resolving the contradiction between ease of manufacture and manufacturing precision.
2Ease of operation
If inorganic nanosol with high solvent content is used, then processability is improved, but water and gas barrier properties are insufficient for passivation and terminal treatment
Solution Approach 1:
The patent fundamentally changes the compositional parameters by transitioning from solvent-based to solvent-free formulations. This parameter change concentrates the inorganic nanosol particles and organic network-forming components, creating a denser material structure that inherently provides superior water and gas barrier properties while maintaining processability through the liquid-phase application capability.
Solution Approach 2:
The patent develops a composite material system combining inorganic nanosols with organic monomers and silicon compounds that form cross-linked networks. This composite structure creates a dense, interconnected matrix that effectively blocks water and gas penetration, achieving the reliability required for passivation and terminal treatment applications.
3Ease of manufacture
If conventional inorganic nanosol is used, then cost is reduced, but purity is insufficient for electrical, electronic, and energy applications
Solution Approach 1:
The patent changes the purity parameter by implementing enhanced purification processes and selecting high-purity starting materials. This parameter change enables the material to meet the stringent purity requirements for electrical, electronic, and energy applications while maintaining cost-effectiveness through efficient processing and formulation methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a hybrid packaging material with improved dimensional stability, reproducibility, and reliability, suitable for electrical, electronic, and energy applications, including energy devices like photoelectric cells and LEDs, with enhanced water and gas barrier capabilities and cost-effective large-scale production.
Implementation Method 1
surface-treating the inorganic nanosol with an organic metal alkoxide containing an organic function group
Implementation Method 2
substituting the organic solvent with a functional organic monomer or a silicon compound, followed by concentration
Implementation Method 3
does not contract during a drying and curing reaction
Implementation Method 4
a nanoclay dispersed in a solvent or a solvent-free nanoclay is added
Data Source
AI summary
Disclosed herein is a method of manufacturing a hybrid packaging material, comprising the steps of: (a) forming a colloidal inorganic nanosol; (b) surface-treating the inorganic nanosol of step (a) with an organic metal alkoxide containing an organic function group by stirring the inorganic nanosol together with the organic metal alkoxide; (c) replacing a solvent of the inorganic nanosol with an organic solvent different in type from the solvent to prepare an organic solvent-type inorganic nanosol; (d) substituting the organic solvent of the inorganic nanosol of step (c) with a functional organic monomer or a silicon compound, followed by concentration to prepare a solvent-free organic-inorganic hybrid material; and (e) adding a nanoclay dispersed in a solvent to the solvent-free organic-inorganic hybrid material.