Hybrid Panel Manufacturing for Semiconductor Packages
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Solution Overview
Problem
Current semiconductor package manufacturing processes are inefficient, leading to increased costs, decreased reliability, and larger package sizes due to sequential processing of individual subpanels rather than parallel processing, which limits manufacturing efficiency and requires substantial investment in new equipment.
Innovation Solution
A hybrid panel method where multiple subpanels are mounted to a carrier panel, processed as a single unit, and then removed, allowing for parallel processing without the need for new and specialized equipment, thereby enhancing manufacturing efficiency and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential processing of individual subpanels is used, then manufacturing simplicity is maintained, but productivity decreases and production costs increase
Solution Approach 1:
The patent combines multiple individual subpanel processing operations into a single hybrid panel processing step. By mounting multiple subpanels onto a carrier panel to form a hybrid panel, the system enables parallel processing of multiple subpanels simultaneously, thereby increasing productivity without proportionally increasing processing complexity
Solution Approach 2:
The patent segments the manufacturing process into distinct phases: (1) mounting multiple subpanels onto a carrier panel to form a hybrid panel, (2) processing the hybrid panel as a single unit, and (3) removing processed subpanels from the carrier panel. This segmentation allows complex parallel processing to be managed through standardized, repeatable steps
2Productivity
If parallel processing of multiple subpanels is implemented, then productivity increases, but investment in new specialized equipment increases
Solution Approach 1:
The hybrid panel carrier serves multiple functions: it acts as a mounting substrate for multiple subpanels, provides structural support during processing, enables parallel processing capability, and serves as a handling fixture. This multi-functionality eliminates the need for specialized equipment, as existing standard processing equipment can process the hybrid panel structure
Solution Approach 2:
The carrier panel acts as an intermediary between individual subpanels and processing equipment. By introducing this intermediate carrier structure, the system enables parallel processing of multiple subpanels using existing single-subpanel processing equipment, thereby avoiding the need for expensive new specialized parallel processing equipment
3Reliability
If individual subpanels are processed separately, then processing flexibility is maintained, but production costs increase and reliability decreases
Solution Approach 1:
By processing multiple subpanels simultaneously on a hybrid panel, the patent achieves consistent processing conditions across all subpanels, reducing variability and improving reliability. The combined processing approach also reduces per-unit manufacturing costs through economies of scale
Data Source
AI summary
A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.