Hybrid Carrier Panel Processing for Parallel Subpanel Packaging
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Solution Overview
Problem
Current semiconductor package manufacturing methods are inefficient, leading to increased costs, decreased reliability, and larger package sizes due to sequential processing of subpanels rather than parallel processing, which limits manufacturing efficiency and requires substantial investment in new equipment.
Innovation Solution
A hybrid panel method where subpanels are mounted to a carrier panel, allowing for parallel processing and efficient manufacturing without the need for new equipment, utilizing a carrier panel that provides structural support and can withstand high temperatures and chemical exposures, enabling the formation of signal redistribution structures and other processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential processing of subpanels is used, then manufacturing cost is reduced and equipment complexity is minimized, but manufacturing efficiency and productivity decrease
Solution Approach 1:
The manufacturing process is segmented into multiple subpanels that can be processed simultaneously on a single carrier panel. Each subpanel represents an independent processing unit that can undergo parallel fabrication steps, thereby increasing overall productivity without requiring proportionally more complex equipment.
Solution Approach 2:
Multiple subpanels are merged onto a single carrier panel, allowing them to be processed together in parallel. This combining approach enables simultaneous manufacturing of multiple devices using the same equipment, significantly improving productivity while avoiding the need for separate processing lines.
2Loss of time
If sequential processing of subpanels is used, then equipment investment is minimized, but manufacturing time and production cost increase
Solution Approach 1:
The carrier panel enables continuous processing of multiple subpanels through all fabrication steps simultaneously. Instead of completing one subpanel at a time, the system maintains continuous useful action across all subpanels in parallel, reducing total manufacturing time while keeping equipment investment minimal.
Solution Approach 2:
Multiple subpanels are prepared and mounted on the carrier panel in advance before the actual fabrication process begins. This preliminary arrangement allows the manufacturing system to operate at full capacity from the start, eliminating idle time and reducing overall production time without adding equipment complexity.
3Productivity
If parallel processing of subpanels is implemented, then manufacturing efficiency increases, but equipment cost and complexity increase
Solution Approach 1:
A single carrier panel is designed to serve multiple functions: it holds, aligns, and processes multiple subpanels simultaneously through all fabrication steps. This multi-functional design enables parallel processing of subpanels using one piece of equipment, achieving high productivity without proportionally increasing equipment cost.
Solution Approach 2:
The carrier panel acts as an intermediary structure that enables parallel processing without requiring multiple independent processing systems. It mediates between the subpanels and the fabrication equipment, allowing efficient resource utilization and reducing the need for expensive duplicate equipment.
Data Source
AI summary
A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.