Hybrid Pillar-Container Capacitor Structure for DRAM Stability

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Solution Overview

Problem

Existing capacitors for DRAM and integrated circuitry face challenges in achieving optimal capacitance and structural stability, with container-type capacitors offering higher capacitance but being less stable than pillar-type capacitors, and having a wider spread of capacitances due to fabrication difficulties.

Innovation Solution

The development of capacitor configurations that combine container-type and pillar-type structures, where lower portions have pillar-type configurations and upper portions have container-type configurations, utilizing conductive liners and fill materials with dielectric materials to enhance capacitance and stability, and support structures to provide structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If container-type capacitor structure is used, then capacitance is increased, but structural stability deteriorates

Engineering Contradiction:
ImprovecapacitanceVSAvoidstructural stability
Core Design Contradiction:
Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The capacitor structure is divided into two distinct parts: a lower pillar-type portion providing structural stability and an upper container-type portion providing high capacitance. This segmentation allows each part to fulfill its specific function without compromising the other, resolving the contradiction between capacitance and structural stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the capacitor are given different structural qualities - the lower portion has the rigid pillar structure for stability, while the upper portion has the expanded container structure for capacitance. This local differentiation enables simultaneous achievement of both structural integrity and high capacitance.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If container-type capacitor structure is used, then capacitance is increased, but manufacturing precision deteriorates

Engineering Contradiction:
ImprovecapacitanceVSAvoidcapacitance uniformity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

By separating the capacitor into pillar and container portions, the manufacturing process can be optimized differently for each section. The pillar portion can be fabricated with high precision using standard processes, while the container portion's geometry is better controlled through the hybrid design, reducing capacitance variation across the array.

Inventive Principle:
Principle #1Segmentation

3Stability of the object's composition

If pillar-type capacitor structure is used, then structural stability is improved, but capacitance decreases

Engineering Contradiction:
Improvestructural stabilityVSAvoidcapacitance
Core Design Contradiction:
Stability of the object's compositionVSQuantity of substance

Solution Approach 1:

The invention merges the advantages of both pillar-type and container-type capacitor structures into a single hybrid design. The pillar portion contributes structural stability while the container portion contributes high capacitance, achieving a synergistic effect that surpasses either structure alone.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10566136B2Capacitors, integrated assemblies including capacitors, and methods of forming integrated assemblies
Publication Date: 2020.02.18 MICRON TECHNOLOGY INC
  • US10566136B2 patent drawing
  • US10566136B2 patent drawing
  • US10566136B2 patent drawing

AI summary

Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.