Hybrid Power Module Cooling to Reduce Coolant Leak Risk
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Solution Overview
Problem
Existing automotive cooling systems for power switches face challenges in efficiently dissipating heat while minimizing coolant leaks and reducing production and maintenance costs, particularly when using multiple active heat sinks.
Innovation Solution
A combination of active and passive cooling systems is employed, where a passive heat sink is integrated with an active heat sink to dissipate heat from power switches, using a thermo-conductive cooling structure that does not directly contact a coolant, thereby reducing the risk of leaks and lowering costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple active heat sinks are used to dissipate heat from power switches, then heat dissipation efficiency is improved, but the risk of coolant leaks increases and maintenance costs rise
Solution Approach 1:
The patent combines passive and active cooling systems into a hybrid configuration. The passive heat sink provides structural support and supplementary heat dissipation without coolant, while the active heat sink handles high-heat dissipation tasks. This merging reduces the number of active coolant-based components, thereby lowering leak risk while maintaining effective heat dissipation.
Solution Approach 2:
The passive heat sink acts as an intermediary between the power switches and the active heat sink. It provides a thermal pathway for heat dissipation without requiring direct coolant contact, serving as a buffer that reduces the reliance on multiple active coolant-based heat sinks and consequently lowers leak risk.
2Temperature
If multiple active heat sinks are used to dissipate heat from power switches, then heat dissipation efficiency is improved, but production and maintenance costs increase
Solution Approach 1:
The hybrid cooling system merges passive and active cooling approaches, reducing the total number of active heat sinks required. This decreases production complexity and component count, leading to lower manufacturing and maintenance costs while still achieving effective heat dissipation through the combined thermal pathways.
Solution Approach 2:
The passive heat sink components are simpler and more cost-effective to manufacture compared to active heat sinks with coolant channels and seals. By using passive heat sink structures for support and supplementary cooling, the system reduces reliance on expensive active components, lowering overall production and maintenance expenses.
3Ease of manufacture
If a passive heat sink is used to provide structural support and heat dissipation, then design flexibility and cost reduction are achieved, but cooling effectiveness may be limited compared to active systems
Solution Approach 1:
The system merges passive heat sink structures with active heat sink functionality. The passive heat sink provides structural support and supplementary cooling, while the active heat sink handles high-heat dissipation requirements. This combination ensures that the limitations of passive cooling are compensated by active cooling, maintaining overall cooling effectiveness.
Solution Approach 2:
The passive heat sink serves multiple functions: it provides structural support for the power switches, acts as a thermal pathway for heat dissipation, and reduces the need for additional active cooling components. This multi-functionality achieves design flexibility and cost reduction without significantly compromising cooling effectiveness, as the active heat sink handles the remaining thermal load.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combined cooling system effectively dissipates heat from power switches, minimizing coolant leaks and reducing production and maintenance costs by utilizing a passive heat sink that provides design flexibility and structural support, while maintaining efficient thermal performance.
Implementation Method 1
Heat sinks provide effective means of dissipating heat by thermally conducting heat into a fluid medium, often via a Thermal Interface Material (TIM)
Implementation Method 2
sintering a fin system to a first base substrate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate
Data Source
AI summary
A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.