Organic-Inorganic Hybrid Resin for LED Packaging Stability
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Solution Overview
Problem
Conventional resin materials used in LED packaging, such as polyphthalamide, suffer from yellowing, thermal instability, and inferior processability, leading to longer molding times and reduced reflectivity, making them unsuitable for high-temperature and high-brightness applications.
Innovation Solution
An organic-inorganic hybrid resin is developed by reacting silsesquioxane prepolymers with metal oxide clusters and epoxy resin, which maintains a non-flowable state at low temperatures, exhibits high melt viscosity, and rapid reactivity, allowing for improved processability and high reflectivity when combined with inorganic fillers and hardeners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional resin materials (such as polyphthalamide) are used in LED packaging, then the molding composition can be easily processed, but the resin suffers from yellowing and thermal instability during high-temperature and long-term operation
Solution Approach 1:
The patent employs a composite molding composition consisting of epoxy resin (50-90 wt%), silsesquoxane prepolymer (5-30 wt%), and inorganic fillers (10-40 wt%). This composite structure combines the advantages of organic resins (processability, adhesion) with inorganic materials (thermal stability, reflectivity), resolving the contradiction between ease of manufacture and reliability in high-temperature LED packaging applications
2Ease of manufacture
If conventional resin materials are used, then the material can be readily molded, but the molding time is longer due to inferior flowability and reactivity
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating silsesquoxane prepolymer with reactive functional groups (epoxy, hydroxyl, carboxyl) that enhance reactivity and flowability. The specific parameter adjustment of adding 5-30 wt% silsesquoxane prepolymer to the epoxy resin system accelerates curing reaction and improves mold filling, thereby reducing molding time while maintaining ease of manufacture
3Strength
If ceramic materials are used for reflective cups, then high mechanical strength is achieved, but the material is not suitable for fabricating smaller size reflective cups and has inferior reflectivity
Solution Approach 1:
The patent creates a composite material system where inorganic fillers (including ceramic particles) are dispersed in an epoxy-silsesquoxane matrix. This composite approach maintains the mechanical strength benefits of ceramics while enabling small-size fabrication through the resin's flowability and the fillers' enhanced reflectivity, achieving both high strength and adaptability for miniaturized LED packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid resin provides a molding composition with enhanced thermal and light stability, rapid curing, and high reflectivity, suitable for use in LED packaging, enabling efficient and reliable production of photoelectric devices.
Implementation Method 1
The organic-inorganic hybrid resin is a reaction product of a first composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), wherein the reactant (a) is a silsesquoxane prepolymer with metal oxide clusters
Implementation Method 2
maintains a non-flowable state at low temperatures, exhibits high melt viscosity, and rapid reactivity
Implementation Method 3
allowing for improved processability and high reflectivity when combined with inorganic fillers and hardeners
Data Source
AI summary
An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.