Hybrid RF Filter Pinning With Internal Crossover for Single-Layer PCB
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Solution Overview
Problem
Conventional radio frequency filters for GPS systems require multiple routing layers or different pinning configurations, leading to increased costs and manufacturing complexity, as single-layer PCBs restrict signal trace crossover, affecting the efficiency of filtering and amplification processes.
Innovation Solution
A hybrid pinning package with a specific pin configuration allows for internal crossover structures using insulation layers and Y-branch connections, enabling the same device to operate on a single-layer PCB without requiring different parts or complex routing, by routing signals through a crossover structure that isolates conductors and uses RF stubs with minimal impact on signal wavelength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional pinning configurations are used with single-layer PCBs, then signal trace crossover is restricted, but manufacturing complexity and costs increase due to required multi-layer PCBs or different pinning configurations
Solution Approach 1:
The patent applies dimensionality change by introducing an internal crossover structure within the RF device package that operates in a different spatial dimension than the PCB trace layer. The crossover structure includes conductors arranged in a specific geometric pattern (e.g., interdigitated fingers) that allows signal paths to cross without requiring multiple PCB layers. This internal 3D arrangement of conductors resolves the 2D routing constraint on single-layer PCBs, enabling complex signal routing while maintaining manufacturing simplicity.
Solution Approach 2:
The patent implements nesting by placing the crossover structure internally within the RF device package, effectively nesting a complete signal routing solution inside the device itself. The crossover structure is embedded within the package substrate or housing, allowing the device to contain its own routing infrastructure. This nested approach eliminates the need for external multi-layer PCB routing, as the crossover functionality is self-contained within the device boundaries.
2Adaptability or versatility
If different pinning configurations are used to avoid trace crossover, then signal routing is simplified, but device interchangeability and manufacturing flexibility are reduced
Solution Approach 1:
The patent applies universality by designing a single pinning configuration that serves multiple functions through the internal crossover structure. The same pin assignment can accommodate different signal routing needs (crossover or non-crossover) depending on how the internal conductors are configured. This multi-functional pinning approach allows the same device package to be used in various circuit layouts without requiring different pin assignments, thereby maintaining device interchangeability while providing routing flexibility.
Solution Approach 2:
The patent uses segmentation by dividing the internal conductor structure into separate, independently configurable segments or groups. These segmented conductors can be selectively connected or disconnected to create different routing patterns (crossover or straight-through) while maintaining the same external pin configuration. This segmentation allows a single device type to adapt to different routing requirements without changing the pinout, enhancing both interchangeability and routing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient filtering and amplification of GPS frequencies L1 and L5 without the need for multi-layer PCBs or different pinning configurations, reducing manufacturing complexity and costs while maintaining signal integrity.
Implementation Method 1
internal crossover structures using insulation layers and Y-branch connections, enabling the same device to operate on a single-layer PCB without requiring different parts or complex routing
Implementation Method 2
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters are devices which make use of the properties of piezoelectric material to convert electrical signals to acoustic waves and back to electrical signals
Data Source
AI summary
Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.