Hybrid Sealing Structure for Spatial Light Modulator Thermal Shock

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Solution Overview

Problem

Spatial light modulators, particularly those used in automotive environments, are vulnerable to moisture ingress and mechanical stress from conventional encapsulation methods, leading to image distortion and failure in thermal shock tests.

Innovation Solution

A hybrid sealing element with a primary portion made of a material with a high coefficient of thermal expansion and a secondary portion with a low coefficient of thermal expansion is used to encapsulate the spatial light modulator, preventing moisture ingress and minimizing mechanical stress, ensuring the modulator performs reliably across a wide range of temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional single-material sealing element is used to encapsulate the spatial light modulator, then the device structure is simple, but the sealing element cannot simultaneously prevent moisture ingress and withstand thermal shock without causing mechanical stress

Engineering Contradiction:
Improveprotection against moisture ingress and thermal shockVSAvoidsealing element structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sealing element is divided into two distinct portions: a first portion surrounding the light modulating region and a second portion covering the electrical connection region. Each portion is made of different materials with specific thermal expansion properties, allowing them to independently address different protection requirements without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the sealing element are assigned different material properties. The first portion uses a material with high coefficient of thermal expansion to accommodate optical region expansion, while the second portion uses a material with low coefficient of thermal expansion to protect electrical connections from stress, creating localized optimization throughout the sealing structure.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If a sealing element with high coefficient of thermal expansion material is used, then the sealing effect is maintained across wide temperature ranges, but mechanical stress is applied to the spatial light modulator causing image distortion

Engineering Contradiction:
Improvesealing effect stability across temperatureVSAvoidmechanical stress and image distortion
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The sealing element is segmented into two portions with different material properties. The first portion (surrounding the light modulating region) uses high coefficient of thermal expansion material to maintain sealing effect, while the second portion (covering electrical connections) uses low coefficient material to minimize stress, thereby resolving the contradiction between sealing stability and mechanical stress reduction.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by assigning different thermal expansion characteristics to different regions: the optical region (first portion) benefits from high thermal expansion material for sealing stability, while the electrical connection region (second portion) benefits from low thermal expansion material to avoid mechanical stress and image distortion.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If a sealing element with low coefficient of thermal expansion material is used, then mechanical stress on the spatial light modulator is minimized, but the sealing effect deteriorates when exposed to thermal shock

Engineering Contradiction:
Improvemechanical stress reductionVSAvoidsealing effect under thermal shock
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The sealing element is divided into two functional portions: the first portion (around the light modulating region) uses high coefficient of thermal expansion material to maintain sealing effect during thermal shock, while the second portion (over electrical connections) uses low coefficient material to minimize mechanical stress, thus resolving the contradiction between stress reduction and sealing reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions are assigned different material properties optimized for their specific functions: the first portion uses high thermal expansion material for sealing stability under thermal shock, while the second portion uses low thermal expansion material for mechanical stress reduction, achieving both goals simultaneously through spatial differentiation of material properties.

Inventive Principle:
Principle #3Local quality

4Reliability

If the sealing element covers the electrical connection region, then moisture protection is improved, but the electrical connections may be damaged by thermal expansion stress

Engineering Contradiction:
Improvemoisture protection of electrical connectionsVSAvoidelectrical connection durability
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The sealing element is segmented such that the second portion specifically covers the electrical connection region with a material of low coefficient of thermal expansion. This localized coverage provides moisture protection to electrical connections while the low thermal expansion property prevents thermal stress from damaging the connections, resolving the contradiction between protection and durability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electrical connection region is assigned a specific material property (low coefficient of thermal expansion) within the sealing element to optimize both moisture protection and mechanical stress reduction. This local quality assignment ensures that electrical connections receive tailored protection that simultaneously achieves sealing and stress minimization.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hybrid sealing element effectively protects spatial light modulators from moisture and mechanical stress, allowing them to pass rigorous automotive testing without image distortion, ensuring reliable performance in varying environmental conditions.

Implementation Method 1

a sealing element arranged to prevent the ingress of moisture to the spatial light modulator

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

The sealing element comprises first and second portions comprising first and second materials that are selected to maintain the sealing effect even when the display device is exposed to a wide range of temperatures and to thermal shocks

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12541104B2Display device and method
Publication Date: 2026.02.03 ENVISICS LTD
  • US12541104B2 patent drawing
  • US12541104B2 patent drawing
  • US12541104B2 patent drawing

AI summary

There is provided a display device comprising a substrate; a spatial light modulator and a sealing element. The spatial light modulator is mounted on the substrate and comprises a light modulating region and an electrical connection region adjacent to the light modulating region. The sealing element comprises a primary portion comprising a first material and a secondary portion comprising a second material. The primary portion of the sealing element extends around at least a portion of a perimeter of the light modulating region and the secondary portion of the sealing element extends over the electrical connection region. The first material has a first coefficient of thermal expansion that is greater than a second coefficient of thermal expansion of the second material.