Hybrid Semiconductor Module Structure Space Utilization
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Solution Overview
Problem
Existing semiconductor packages face challenges in reducing size and efficiently utilizing space due to components of different heights, leading to difficulties in coupling and creating empty spaces when combining modules and packages.
Innovation Solution
A hybrid semiconductor module structure is designed with a first and second package substrate, where the second substrate has overlapping and non-overlapping areas, allowing taller components to be positioned in non-overlapping areas, reducing empty space and enabling a more compact module structure by using solder balls or other interconnects for coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components of different heights are positioned on package substrates, then functional requirements are met, but empty space is created and module size increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Package substrates are arranged vertically with overlapping areas aligned, allowing components of different heights to be positioned in the vertical dimension without creating horizontal empty space. This dimensional change enables compact module structure while accommodating heterogeneous component heights.
Solution Approach 2:
The patent implements a nested arrangement where the second package substrate is positioned within the vertical projection of the first package substrate's overlapping area. This nesting allows the taller third component on the second substrate to be surrounded and supported by the first substrate structure, eliminating empty space and reducing overall module volume.
2Reliability
If taller components are used to meet functional requirements, then performance is improved, but module height increases and space utilization decreases
Solution Approach 1:
The patent resolves the conflict between component height requirements and module volume by utilizing the vertical stacking dimension. Taller components are positioned on the second package substrate in areas that overlap with the first substrate, allowing their height to extend upward without increasing the module's horizontal footprint. This enables high-performance taller components while maintaining compact overall volume.
3Volume of moving object
If package substrates are coupled with overlapping areas, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the package substrate into distinct overlapping and non-overlapping areas, with components strategically positioned on each area. This segmentation allows the coupling structure to be designed in modular sections, where the overlapping area provides mechanical support and electrical interconnection, while the non-overlapping area accommodates taller components. The segmentation simplifies the coupling process by creating discrete functional zones.
Data Source
AI summary
Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package substrate has a first area. The first component has a first height and is positioned on the first area. The second package substrate is coupled to the first package substrate. The second package substrate has second and third areas. The second area of the second package substrate vertically overlaps with the first area of the first package substrate The third area of the second package substrate is non-overlapping with the first area of the first package substrate. The second component has a second height and is positioned on the second area. The third component is positioned on the third area. The third component has a third height that is greater than each of the first and second heights.