Hybrid 2D-3D Sensor Array With Metalens for Aligned Depth Imaging

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing 2D and 3D depth sensors in computer vision systems face challenges such as different fields of view, resolution mismatches, large form factor, and high computational demands, leading to alignment issues and increased power consumption, which are unsuitable for real-time applications like ADAS and autonomous driving.

Innovation Solution

A hybrid sensor system with a shared field of view, combining a 2D sensing region and a 3D depth sensing region, using metalenses to direct light to appropriate pixels, and a processing circuit to integrate 2D and 3D image information, along with a region of interest scanning mechanism to optimize power and computation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple separate detection systems are used to provide 2D image data and 3D depth data, then the field of view and detection capabilities are improved, but the device complexity and alignment difficulty increase

Engineering Contradiction:
Improvedetection capabilitiesVSAvoidsystem complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines 2D imaging pixels and 3D depth sensing pixels into a single hybrid sensor array, eliminating the need for multiple separate detection systems. This integration reduces device complexity while maintaining the ability to capture both 2D visual information and 3D depth information simultaneously through shared optical path and synchronized readout circuits.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The hybrid sensor array implements multi-functionality by enabling each pixel to contribute to both 2D imaging and 3D depth sensing operations. The system can operate in different modes (2D imaging mode, 3D depth mapping mode, or combined mode) depending on application requirements, providing universal detection capabilities within a single device structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Length of stationary object

If separate detection systems are used for 2D and 3D imaging, then detection range is improved, but computational resources and power consumption increase

Engineering Contradiction:
Improvedetection rangeVSAvoidpower consumption
Core Design Contradiction:
Length of stationary objectVSUse of energy by moving object

Solution Approach 1:

By merging 2D and 3D sensing functions into a single hybrid sensor array with shared optical components and integrated readout circuits, the patent reduces the total computational burden compared to processing data from separate systems. The synchronized capture and spatially-correlated data structure enable more efficient algorithms for depth mapping and 3D reconstruction, lowering power consumption while maintaining extended detection range.

Inventive Principle:
Principle #5Merging (Combining)

3Length of stationary object

If separate detection systems are used for 2D and 3D imaging, then detection range is improved, but alignment precision deteriorates

Engineering Contradiction:
Improvedetection rangeVSAvoidalignment precision
Core Design Contradiction:
Length of stationary objectVSMeasurement precision

Solution Approach 1:

The hybrid sensor array merges 2D and 3D sensing functions at the pixel level, ensuring that corresponding pixels for 2D imaging and 3D depth measurement are spatially aligned by design. This physical integration eliminates alignment errors between separate systems, achieving sub-pixel precision while maintaining extended detection range through the shared optical path.

Inventive Principle:
Principle #5Merging (Combining)

4Length of moving object

If a hybrid sensor system is used to reduce form factor, then device mobility is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveform factorVSAvoidpixel alignment precision
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent integrates 2D and 3D sensing functions into a single hybrid sensor array fabricated using standard CMOS processes, achieving compact form factor suitable for mobile devices. The manufacturing process employs precise photolithography and layer alignment techniques to ensure sub-pixel registration between 2D imaging pixels and 3D depth sensing pixels, meeting high precision requirements through advanced semiconductor manufacturing capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system provides high-resolution, high-quality 3D imaging with reduced form factor and power consumption, enhancing object detection range and mobility in applications like ADAS and autonomous driving.

Implementation Method 1

a metalens on the hybrid sensing array, the metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region, and to direct the light emitted by the light source and reflected from the object towards the 3D depth sensing region, wherein light incident on the metalens is directed according to wavelength

Methodology Applied
Scientific EffectLight refraction and wavelength-based direction: Refraction

Implementation Method 2

a hybrid sensing array including a 2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object

Methodology Applied
Scientific EffectLight detection by photodetectors: Photoelectric Effect

Data Source

PatentEP3896489B1Hybrid sensor system and method for providing 3D imaging
Publication Date: 2026.02.11 SAMSUNG ELECTRONICS CO LTD
  • EP3896489B1 patent drawingFigure 1
  • EP3896489B1 patent drawingFigure 2A
  • EP3896489B1 patent drawingFigure 2B

AI summary

Provided is a 3D depth sensing system and method of providing an image based on a hybrid sensing array. The 3D sensing system including a light source configured to emit light, a hybrid sensing array comprising a 2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object, a metalens on the hybrid sensing array, the metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region, and to direct the light emitted by the light source and reflected from the object towards the 3D depth sensing region, and a processing circuit configured to combine 2D image information provided by the 2D sensing region and 3D information provided by the 3D depth sensing region to generate a combined 3D image.