Hybrid Sensor Communication Device Power Supply Segmentation

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Solution Overview

Problem

Existing hybrid sensor/communication devices face challenges in having a simple and easy-to-manufacture power supply that efficiently powers both RFID communication devices and sensor devices, particularly in providing different voltage levels required by various semiconductor materials.

Innovation Solution

A hybrid sensor/communication device utilizing organic and/or amorphous semiconductor materials printed atop a substrate, coupled with an RFID device that provides power and communication, featuring an integrated circuit with inorganic crystalline semiconductor material, and a power supply that rectifies energy received by the antenna to generate different voltage levels for both the RFID integrated circuit and the sensor processor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single power supply is used for both RFID and sensor devices, then device complexity is reduced, but it becomes difficult to provide different voltage levels required by different semiconductor materials

Engineering Contradiction:
Improvepower supply structureVSAvoidvoltage level provision
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The power supply is segmented into multiple independent power supply units, each dedicated to providing power at specific voltage levels for different components. The RFID device includes a first power supply unit for the inorganic crystalline semiconductor integrated circuit and a second power supply unit for the organic/amorphous semiconductor processor, allowing each unit to be optimized for its specific voltage requirements while maintaining overall system integration.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If organic and inorganic semiconductor materials are used together, then functional versatility is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvesensor and communication functionalityVSAvoidpower supply integration
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The power supply system is designed with multi-functionality to handle both organic and inorganic semiconductor devices. Multiple power supply units can operate simultaneously to provide different voltage levels, enabling the system to power diverse components including RFID integrated circuits, sensor processors, and various sensor elements using different semiconductor materials, all through a unified power management architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable and efficient communication between the sensor device and external devices, accurate timing, and temperature compensation for sensor data, while allowing for customizable and cost-effective manufacturing by combining off-the-shelf RFID components with custom sensor configurations.

Implementation Method 1

a power supply that rectifies energy received by the antenna to generate different voltage levels for both the RFID integrated circuit and the sensor processor

Methodology Applied
Scientific EffectRectification:

Data Source

PatentEP2240890B1Hybrid sensor/communication device and method
Publication Date: 2016.03.16 AVERY DENNISON CORP
  • EP2240890B1 patent drawingFigure 1~2A
  • EP2240890B1 patent drawingFigure 2B
  • EP2240890B1 patent drawingFigure 2C

AI summary

A hybrid sensor/communication device includes a radio frequency identification (RFID) communication device coupled to a sensor device that includes organic and/or amorphous semiconductor material. The organic and/or amorphous semiconductor material may be printed atop a substrate of the device, the same substrate upon which antenna elements of the RFID device are located. The organic and/or amorphous semiconductor material may form an organic/amorphous semiconductor material processor that is coupled to sensor pads of the sensor device. An integrated circuit of the RFID device, which may be a part of an interposer or strap, and which may utilize an inorganic crystalline semiconductor material such as crystalline silicon, is coupled to the organic/amorphous semiconductor material processor. The RFID device provides power to the sensor device, and allows communication between the sensor device and external devices outside of the hybrid sensor/communication device.